Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more | 2022-10-04 |
| 11288429 | Electrical mask validation | Derren N. Dunn, Michael A. Guillorn, Shawn P. Fetterolf | 2022-03-29 |
| 11177130 | Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography | Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix, Rudy J. Wojtecki | 2021-11-16 |
| 11056418 | Semiconductor microcooler | Donald F. Canaperi, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2021-07-06 |
| 11049789 | Semiconductor microcooler | Donald F. Canaperi, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2021-06-29 |
| 11037786 | Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography | Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix, Rudy J. Wojtecki | 2021-06-15 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more | 2021-03-02 |
| 10921716 | Lithographic dose characterization | Christopher F. Robinson | 2021-02-16 |
| 10921715 | Semiconductor structure for optical validation | Derren N. Dunn, Michael A. Guillorn, Shawn P. Fetterolf | 2021-02-16 |
| 10650111 | Electrical mask validation | Derren N. Dunn, Michael A. Guillorn, Shawn P. Fetterolf | 2020-05-12 |
| 10642161 | Baseline overlay control with residual noise reduction | Scott D. Halle, Richard C. Johnson, Christopher F. Robinson, Chumeng Zheng | 2020-05-05 |
| 10553522 | Semiconductor microcooler | Donald F. Canaperi, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |
| 10553516 | Semiconductor microcooler | Donald F. Canaperi, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |
| 10490481 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Donald F. Canaperi, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10490480 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Donald F. Canaperi, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10429743 | Optical mask validation | Derren N. Dunn, Michael A. Guillorn, Shawn P. Fetterolf | 2019-10-01 |
| 10347486 | Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography | Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix, Rudy J. Wojtecki | 2019-07-09 |
| 10281826 | Determination of lithography effective dose uniformity | Luciana Meli Thompson, Christopher F. Robinson | 2019-05-07 |
| 10274836 | Determination of lithography effective dose uniformity | Luciana Meli Thompson, Christopher F. Robinson | 2019-04-30 |
| 9709898 | Amplification method for photoresist exposure in semiconductor chip manufacturing | Richard S. Wise | 2017-07-18 |
| 9451684 | Dual pulse driven extreme ultraviolet (EUV) radiation source method | Sadanand V. Deshpande, Veeresh V. Deshpande, Oleg Gluschenkov, Sivarama Krishnan | 2016-09-20 |
| 9301381 | Dual pulse driven extreme ultraviolet (EUV) radiation source utilizing a droplet comprising a metal core with dual concentric shells of buffer gas | Sadanand V. Deshpande, Veeresh V. Deshpande, Oleg Gluschenkov, Sivarama Krishnan | 2016-03-29 |
| 9104113 | Amplification method for photoresist exposure in semiconductor chip manufacturing | Richard Wise | 2015-08-11 |
| 8350235 | Semiconductor intra-field dose correction | Hyung-Rae Lee, Dong-Hee Yu, Sohan S. Mehta, Niall Shepherd | 2013-01-08 |
| 7807335 | Immersion lithography contamination gettering layer | Dario Gil, Dario L. Goldfarb, Steven J. Holmes, David V. Horak, Kurt R. Kimmel +2 more | 2010-10-05 |