Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11956975 | BEOL fat wire level ground rule compatible embedded artificial intelligence integration | Soon-Cheon Seo, Dexin Kong, Takashi Ando, Paul C. Jamison, Hiroyuki Miyazoe +3 more | 2024-04-09 |
| 11930724 | Phase change memory cell spacer | Injo Ok, Nicole Saulnier, Muthumanickam Sankarapandian, Andrew H. Simon, Steven Michael McDermott | 2024-03-12 |
| 11476418 | Phase change memory cell with a projection liner | Injo Ok, Ruqiang Bao, Andrew H. Simon, Kevin W. Brew, Nicole Saulnier +1 more | 2022-10-18 |
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Dario L. Goldfarb +2 more | 2022-10-04 |
| 11456417 | Integrated phase change memory cell projection liner and etch stop layer | Kevin W. Brew, Injo Ok, Nicole Saulnier, Matthew J. BrightSky, Robert L. Bruce | 2022-09-27 |
| 11456415 | Phase change memory cell with a wrap around and ring type of electrode contact and a projection liner | Injo Ok, Ruqiang Bao, Andrew H. Simon, Kevin W. Brew, Nicole Saulnier +2 more | 2022-09-27 |
| 11177319 | RRAM device with spacer for electrode isolation | Hiroyuki Miyazoe, Dexin Kong, Takashi Ando | 2021-11-16 |
| 11158788 | Atomic layer deposition and physical vapor deposition bilayer for additive patterning | Kevin W. Brew, Injo Ok, Nicole Saulnier, Praneet Adusumilli | 2021-10-26 |
| 11081388 | Forming barrierless contact | Kisik Choi, Koichi Motoyama, Ashim Dutta, Benjamin D. Briggs | 2021-08-03 |
| 11081424 | Micro-fluidic channels having various critical dimensions | Ravi K. Bonam, Kamal K. Sikka, Joshua M. Rubin, Fee Li Lie | 2021-08-03 |
| 11037795 | Planarization of dielectric topography and stopping in dielectric | Hari Prasad Amanapu, Cornelius Brown Peethala, Raghuveer R. Patlolla, Chih-Chao Yang | 2021-06-15 |
| 11038104 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Hiroyuki Miyazoe, Shyng-Tsong Chen | 2021-06-15 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Dario L. Goldfarb +2 more | 2021-03-02 |
| 10741756 | Phase change memory with a patterning scheme for tantalum nitride and silicon nitride layers | Injo Ok, Nicole Saulnier, Kevin W. Brew | 2020-08-11 |
| 10672980 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Hiroyuki Miyazoe, Shyng-Tsong Chen | 2020-06-02 |
| 10573808 | Phase change memory with a dielectric bi-layer | Kevin W. Brew, Injo Ok, Nicole Saulnier, Robert L. Bruce | 2020-02-25 |
| 10361367 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Hiroyuki Miyazoe, Shyng-Tsong Chen | 2019-07-23 |
| 9748250 | Deep trench sidewall etch stop | Diego A. Hoyos, Sunit S. Mahajan, William L. Nicol, Scott R. Stiffler | 2017-08-29 |
| 9607847 | Enhanced lateral cavity etch | Brian E. Goodlin, Karen Hildegard Ralston Kirmse | 2017-03-28 |