Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389803 | Magnetoresistive random-access memory (MRAM) with preserved underlying dielectric layer | Ashim Dutta, Terry A. Spooner, Chih-Chao Yang | 2025-08-12 |
| 11735468 | Interconnect structures including self aligned vias | Chih-Chao Yang, Terry A. Spooner, Koichi Motoyama | 2023-08-22 |
| 11264276 | Interconnect integration scheme with fully self-aligned vias | Terry A. Spooner | 2022-03-01 |
| 11244860 | Double patterning interconnect integration scheme with SAV | Terry A. Spooner, Koichi Motoyama, Chih-Chao Yang | 2022-02-08 |
| 11239421 | Embedded BEOL memory device with top electrode pillar | Dexin Kong, Soon-Cheon Seo, Youngseok Kim, Theodorus E. Standaert | 2022-02-01 |
| 11227792 | Interconnect structures including self aligned vias | Chih-Chao Yang, Terry A. Spooner, Koichi Motoyama | 2022-01-18 |
| 11189566 | Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias | Dongbing Shao, Lawrence A. Clevenger, Hao Tang, Jing Sha | 2021-11-30 |
| 11038104 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Hiroyuki Miyazoe, Iqbal Rashid Saraf | 2021-06-15 |
| 10915690 | Via design optimization to improve via resistance | Dongbing Shao, Yongan Xu, Zheng Xu | 2021-02-09 |
| 10886168 | Surface modified dielectric refill structure | Chih-Chao Yang, Terry A. Spooner, Koichi Motoyama | 2021-01-05 |
| 10672980 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Hiroyuki Miyazoe, Iqbal Rashid Saraf | 2020-06-02 |
| 10672984 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Michael Rizzolo, Lawrence A. Clevenger | 2020-06-02 |
| 10381563 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Michael Rizzolo, Lawrence A. Clevenger | 2019-08-13 |
| 10361367 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Hiroyuki Miyazoe, Iqbal Rashid Saraf | 2019-07-23 |
| 10157789 | Via formation using sidewall image transfer process to define lateral dimension | Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot, Hosadurga Shobha +3 more | 2018-12-18 |
| 9508647 | Single damascene interconnect structure | Daniel C. Edelstein, Takeshi Nogami | 2016-11-29 |
| 9490168 | Via formation using sidewall image transfer process to define lateral dimension | Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot, Hosadurga Shobha +3 more | 2016-11-08 |
| 9224686 | Single damascene interconnect structure | Daniel C. Edelstein, Takeshi Nogami | 2015-12-29 |
| 9105641 | Profile control in interconnect structures | Samuel S. Choi, Steven J. Holmes, David V. Horak, Charles W. Koburger, III, Wai-Kin Li +4 more | 2015-08-11 |
| 8835305 | Method of fabricating a profile control in interconnect structures | Chih-Chao Yang, Samuel S. Choi, Steven J. Holmes, David V. Horak, Charles W. Koburger, III +4 more | 2014-09-16 |
| 8835326 | Titanium-nitride removal | John A. Fitzsimmons, David L. Rath, Muthumanickam Sankarapandian, Oscar van der Straten | 2014-09-16 |
| 8754520 | Formation of air gap with protection of metal lines | Takeshi Nogami, David V. Horak, Son V. Nguyen, Shom Ponoth, Chih-Chao Yang | 2014-06-17 |
| 8716133 | Three photomask sidewall image transfer method | Ryan O. Jung, Neal V. Lafferty, Yunpeng Yin | 2014-05-06 |
| 8519540 | Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same | Qinghuang Lin, Sampath Purushothaman, Terry A. Spooner, Shawn Walsh | 2013-08-27 |
| 8450854 | Interconnect structures with patternable low-k dielectrics and method of fabricating same | Qinghuang Lin | 2013-05-28 |