| 10923427 |
SOI wafers with buried dielectric layers to prevent CU diffusion |
Anthony K. Stamper, Mukta G. Farooq |
2021-02-16 |
|
| 10242947 |
SOI wafers with buried dielectric layers to prevent CU diffusion |
Anthony K. Stamper, Mukta G. Farooq |
2019-03-26 |
$28,977,000 |
| 10074562 |
Self aligned contact structure |
Rosa A. Orozco-Teran, Ravikumar Ramachandran, Russell H. Arndt, David L. Rath |
2018-09-11 |
$4,894,000 |
| 10037911 |
Device layer transfer with a preserved handle wafer section |
Anthony K. Stamper, Mukta G. Farooq, Mark D. Jaffe, Randy L. Wolf |
2018-07-31 |
$18,726,000 |
| 9966310 |
Integrated circuit structure having deep trench capacitor and through-silicon via and method of forming same |
Mukta G. Farooq, Anthony K. Stamper |
2018-05-08 |
$5,480,000 |
| 9929085 |
Integrated circuit structure having deep trench capacitor and through-silicon via and method of forming same |
Mukta G. Farooq, Anthony K. Stamper |
2018-03-27 |
$9,410,000 |
| 9892970 |
Integrated circuit structure having deep trench capacitor and through-silicon via and method of forming same |
Mukta G. Farooq, Anthony K. Stamper |
2018-02-13 |
$9,248,000 |
| 9852959 |
Corrosion resistant chip sidewall connection with crackstop and hermetic seal |
Michael J. Shapiro, Natalia Borjemscaia, Vincent J. McGahay |
2017-12-26 |
$7,266,000 |
| 9818637 |
Device layer transfer with a preserved handle wafer section |
Anthony K. Stamper, Mukta G. Farooq, Mark D. Jaffe, Randy L. Wolf |
2017-11-14 |
$7,693,000 |
| 9812404 |
Electrical connection around a crackstop structure |
Michael J. Shapiro, Natalia Borjemscaia |
2017-11-07 |
$8,746,000 |
| 9806025 |
SOI wafers with buried dielectric layers to prevent Cu diffusion |
Anthony K. Stamper, Mukta G. Farooq |
2017-10-31 |
$7,902,000 |
| 9671215 |
Wafer to wafer alignment |
Mukta G. Farooq, Spyridon Skordas |
2017-06-06 |
$2,871,000 |
| 9673176 |
Metal to metal bonding for stacked (3D) integrated circuits |
Tien-Jen Cheng, Mukta G. Farooq |
2017-06-06 |
$2,871,000 |
| 9666563 |
Metal to metal bonding for stacked (3D) integrated circuits |
Tien-Jen Cheng, Mukta G. Farooq |
2017-05-30 |
$1,983,000 |
| 9653432 |
Metal to metal bonding for stacked (3D) integrated circuits |
Tien-Jen Cheng, Mukta G. Farooq |
2017-05-16 |
$2,370,000 |
| 9653431 |
Metal to metal bonding for stacked (3D) integrated circuits |
Tien-Jen Cheng, Mukta G. Farooq |
2017-05-16 |
$2,370,000 |
| 9589806 |
Integrated circuit with replacement gate stacks and method of forming same |
Ruqiang Bao, Unoh Kwon, Huihang Dong |
2017-03-07 |
$9,679,000 |
| 9553054 |
Strain detection structures for bonded wafers and chips |
Mukta G. Farooq, Erdem Kaltalioglu, Wei Lin, Spyridon Skordas, Kevin R. Winstel |
2017-01-24 |
$6,909,000 |
| 9548244 |
Self-aligned contact structure |
Rosa A. Orozco-Teran, Ravikumar Ramachandran, Russell H. Arndt, David L. Rath |
2017-01-17 |
$4,498,000 |
| 9515051 |
Metal to metal bonding for stacked (3D) integrated circuits |
Tien-Jen Cheng, Mukta G. Farooq |
2016-12-06 |
$2,582,000 |
| 9461017 |
Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement |
Mukta G. Farooq, Andrew H. Simon, Anthony K. Stamper |
2016-10-04 |
$4,373,000 |
| 9418865 |
Wet etching of silicon containing antireflective coatings |
Gregory Nowling |
2016-08-16 |
$419,000 |
| 9257336 |
Bottom-up plating of through-substrate vias |
Mukta G. Farooq, Troy L. Graves-Abe |
2016-02-09 |
$571,000 |
| 9252053 |
Self-aligned contact structure |
Rosa A. Orozco-Teran, Ravikumar Ramachandran, Russell H. Arndt, David L. Rath |
2016-02-02 |
$1,325,000 |
| 9153558 |
Electromigration immune through-substrate vias |
Ronald G. Filippi, Kevin Kolvenbach, Ping-Chuan Wang |
2015-10-06 |
$5,963,000 |
