Issued Patents All Time
Showing 51–75 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8288271 | Method for reworking antireflective coating over semiconductor substrate | Hakeem Akinmade Yusuff, Ranee W. Kwong | 2012-10-16 |
| 8236610 | Forming semiconductor chip connections | Louis L. Hsu, Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq | 2012-08-07 |
| 8129286 | Reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, Jeffrey P. Gambino +10 more | 2012-03-06 |
| 8018061 | Integrated circuit hard mask processing system | Wuping Liu, Michael Beck | 2011-09-13 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, Jeffrey P. Gambino +10 more | 2011-02-22 |
| 7755206 | Pad structure to provide improved stress relief | Mukta G. Farooq, Thomas J. Fleischman | 2010-07-13 |
| 7709344 | Integrated circuit fabrication process using gas cluster ion beam etching | Shyng-Tsong Chen, Shom Ponoth, Terry A. Spooner | 2010-05-04 |
| 7691736 | Minimizing low-k dielectric damage during plasma processing | Michael Beck, Karl Hornik, Darryl D. Restaino | 2010-04-06 |
| 7670497 | Oxidant and passivant composition and method for use in treating a microelectronic structure | David L. Rath, Shom Ponoth, Michael Beck | 2010-03-02 |
| 7615484 | Integrated circuit manufacturing method using hard mask | Wuping Liu, Michael Beck | 2009-11-10 |
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, Jeffrey P. Gambino +10 more | 2009-09-22 |
| 7566649 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2009-07-28 |
| 7541679 | Exposed pore sealing post patterning | Edward C. Cooney, III, Jeffrey P. Gambino, Stephen E. Luce, Thomas L. McDevitt, Lee M. Nicholson +1 more | 2009-06-02 |
| 7517790 | Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification | Stephen M. Gates, Michael Lane, Eric G. Liniger | 2009-04-14 |
| 7517736 | Structure and method of chemically formed anchored metallic vias | Sanjay C. Mehta, Daniel C. Edelstein, Stephan Grunow, Henry A. Nye, III, David L. Rath | 2009-04-14 |
| 7488679 | Interconnect structure and process of making the same | Theodorus E. Standaert, Pegeen M. Davis, Stephen E. Greco, Tze-man Ko, Naftali E. Lustig +2 more | 2009-02-10 |
| 7480990 | Method of making conductor contacts having enhanced reliability | William J. Cote, Nancy Anne Greco, Thomas Ivers, Steven Moskowitz | 2009-01-27 |
| 7473159 | Detection of diamond contamination in polishing pad and reconditioning system therefor | Laertis Economikos | 2009-01-06 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, Jeffrey P. Gambino +10 more | 2008-07-29 |
| 7354333 | Detection of diamond contamination in polishing pad | Laertis Economikos | 2008-04-08 |
| 7341948 | Method of making a semiconductor structure with a plating enhancement layer | Shom Ponoth, Steven S. Chen, Terry A. Spooner | 2008-03-11 |
| 7332821 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2008-02-19 |
| 7327033 | Copper alloy via bottom liner | Daniel C. Edelstein, Edward C. Cooney, III, Jeffrey P. Gambino, Anthony K. Stamper | 2008-02-05 |
| 7180187 | Interlayer connector for preventing delamination of semiconductor device | Jeffrey P. Gambino, Anthony K. Stamper | 2007-02-20 |
| 7135398 | Reliable low-k interconnect structure with hybrid dielectric | Stephen E. Greco, Jia Lee, Stephen M. Gates, Terry A. Spooner, Matthew S. Angyal +3 more | 2006-11-14 |