Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9652729 | Metrology management | William K. Hoffman, Timothy L. Holmes, Jonathan Levy, Christopher E. Pepe, Eric P. Solecky +1 more | 2017-05-16 |
| 7998880 | Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties | Son V. Nguyen, Sarah L. Lane, Eric G. Liniger, Kensaku Ida | 2011-08-16 |
| 7910484 | Method for preventing backside defects in dielectric layers formed on semiconductor substrates | Chester T. Dziobkowski, Thomas Houghton, Emily R. Kinser, Yun-Yu Wang | 2011-03-22 |
| 7888741 | Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same | Daniel C. Edelstein, Alfred Grill, Vishnubhai V. Patel | 2011-02-15 |
| 7847402 | BEOL interconnect structures with improved resistance to stress | Griselda Bonilla, Christos D. Dimitrakopoulos, Stephen M. Gates, Jae Hak Kim, Michael Lane +4 more | 2010-12-07 |
| 7820559 | Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Darren N. Dunn +7 more | 2010-10-26 |
| 7749892 | Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices | Griselda Bonilla, Christos D. Dimitrakopoulos, Son V. Nguyen, Alfred Grill, Satyanarayana V. Nitta +1 more | 2010-07-06 |
| 7737029 | Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby | Jae Hak Kim, Griselda Bonilla, Steven E. Molis, Hosadurga Shobha, Johnny Widodo | 2010-06-15 |
| 7691736 | Minimizing low-k dielectric damage during plasma processing | Michael Beck, John A. Fitzsimmons, Karl Hornik | 2010-04-06 |
| 7678258 | Void-free damascene copper deposition process and means of monitoring thereof | Panayotis Andricacos, Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Keith Kwietniak +4 more | 2010-03-16 |
| 7615482 | Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength | Daniel C. Edelstein, Alexandros T. Demos, Stephen M. Gates, Alfred Grill, Steven E. Molis +3 more | 2009-11-10 |
| 7494938 | Advanced low dielectric constant organosilicon plasma chemical vapor deposition films | Son V. Nguyen, Sarah L. Lane, Jia Lee, Kensaku Ida, Takeshi Nogami | 2009-02-24 |
| 7459388 | Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses | Jaehak Kim, Johnny Widodo | 2008-12-02 |
| 7407605 | Manufacturable CoWP metal cap process for copper interconnects | Donald F. Canaperi, Judith M. Rubino, Sean Smith, Richard O. Henry, James E. Fluegel +1 more | 2008-08-05 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2008-07-22 |
| 7265437 | Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties | Son V. Nguyen, Sarah L. Lane, Eric G. Liniger, Kensaku Ida | 2007-09-04 |
| 7253106 | Manufacturable CoWP metal cap process for copper interconnects | Donald F. Canaperi, Judith M. Rubino, Sean Smith, Richard O. Henry, James E. Fluegel +1 more | 2007-08-07 |
| 7202564 | Advanced low dielectric constant organosilicon plasma chemical vapor deposition films | Son V. Nguyen, Sarah L. Lane, Jia Lee, Kensaku Ida, Takeshi Nogami | 2007-04-10 |
| 7102232 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2006-09-05 |
| 7067437 | Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same | Daniel C. Edelstein, Alfred Grill, Vishnubhai V. Patel | 2006-06-27 |
| 6939797 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2005-09-06 |
| 6864180 | Method for reworking low-k polymers used in semiconductor structures | Delores Bennett, John A. Fitzsimmons, John Fritche, Jeffrey Hedrick, Chih-Chien Liu +2 more | 2005-03-08 |
| 6806182 | Method for eliminating via resistance shift in organic ILD | Shahab Siddiqui, Erdem Kaltalioglu, Delores Bennett, Chih-Chih Liu, Hsueh-Chung Chen +3 more | 2004-10-19 |
| 6784485 | Diffusion barrier layer and semiconductor device containing same | Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Lynne M. Gignac +5 more | 2004-08-31 |
| 6737747 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2004-05-18 |