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Releasable buried layer for 3-D fabrication and methods of manufacturing |
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Enhanced diffusion barrier for interconnect structures |
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Enhanced diffusion barrier for interconnect structures |
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Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system |
Charles L. Reynolds, William E. Sablinski, Jiali Wu |
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Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular species |
Shyng-Tsong Chen, Nancy R. Klymko, Anita Madan, Sanjay C. Mehta |
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| 7737029 |
Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby |
Jae Hak Kim, Griselda Bonilla, Darryl D. Restaino, Hosadurga Shobha, Johnny Widodo |
2010-06-15 |
| 7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength |
Daniel C. Edelstein, Alexandros T. Demos, Stephen M. Gates, Alfred Grill, Vu Ngoc Tran Nguyen +3 more |
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Electrically conductive polymeric materials and use thereof |
Ali Afzali-Ardakani, Marie Angelopoulos, Vincent Albert Bourgault, Liam D. Comerford, Michael Wayne Mirre +4 more |
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Electrically conductive polymeric materials and use thereof |
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Electrically conductive polymeric materials and use thereof |
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Fluorinated carbon polymer composites |
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Fluorinated carbon polymer composites |
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Fluorinated carbon polymer composites |
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Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment |
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Wet etching of thermally or chemically cured polyimide |
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