| 9040390 |
Releasable buried layer for 3-D fabrication and methods of manufacturing |
Timothy H. Daubenspeck, Gordon C. Osborne, Jr., Wolfgang Sauter, Edmund J. Sprogis |
2015-05-26 |
$2,909,000 |
| 8742581 |
Enhanced diffusion barrier for interconnect structures |
Chih-Chao Yang, Daniel C. Edelstein |
2014-06-03 |
$4,638,000 |
| 8420531 |
Enhanced diffusion barrier for interconnect structures |
Chih-Chao Yang, Daniel C. Edelstein |
2013-04-16 |
$3,567,000 |
| 7932342 |
Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system |
Charles L. Reynolds, William E. Sablinski, Jiali Wu |
2011-04-26 |
$6,102,000 |
| 7838428 |
Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular species |
Shyng-Tsong Chen, Nancy R. Klymko, Anita Madan, Sanjay C. Mehta |
2010-11-23 |
$4,291,000 |
| 7737029 |
Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby |
Jae Hak Kim, Griselda Bonilla, Darryl D. Restaino, Hosadurga Shobha, Johnny Widodo |
2010-06-15 |
$4,416,000 |
| 7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength |
Daniel C. Edelstein, Alexandros T. Demos, Stephen M. Gates, Alfred Grill, Vu Ngoc Tran Nguyen +3 more |
2009-11-10 |
|
| 7585431 |
Electrically conductive polymeric materials and use thereof |
Ali Afzali-Ardakani, Marie Angelopoulos, Vincent Albert Bourgault, Liam D. Comerford, Michael Wayne Mirre +4 more |
2009-09-08 |
$16,659,000 |
| 6168732 |
Electrically conductive polymeric materials and use thereof |
Ali Ardakani, Marie Angelopoulos, Vincent Albert Bourgault, Liam D. Comerford, Michael Wayne Mirre +4 more |
2001-01-02 |
$72,115,000 |
| 6149840 |
Electrically conductive polymeric materials and use thereof |
Ali Ardakani, Marie Angelopoulos, Vincent Albert Bourgault, Liam D. Comerford, Michael Wayne Mirre +4 more |
2000-11-21 |
$39,339,000 |
| 5591285 |
Fluorinated carbon polymer composites |
Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more |
1997-01-07 |
$25,755,000 |
| 5571852 |
Fluorinated carbon polymer composites |
Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more |
1996-11-05 |
$15,326,000 |
| 5556899 |
Fluorinated carbon polymer composites |
Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more |
1996-09-17 |
$12,073,000 |
| 5397863 |
Fluorinated carbon polymer composites |
Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more |
1995-03-14 |
$18,714,000 |
| 5019210 |
Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment |
Ned J. Chou, Ronald D. Goldblatt, John E. Heidenreich, III, Luis M. Ferreiro, deceased |
1991-05-28 |
$19,236,000 |
| 4846929 |
Wet etching of thermally or chemically cured polyimide |
Steven L. Bard, Claudius Feger, John J. Glenning, Gareth G. Hougham, Walter P. Pawlowski +3 more |
1989-07-11 |
$12,654,000 |
