Issued Patents All Time
Showing 1–25 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9565759 | Axiocentric scrubbing land grid array contacts and methods for fabrication | Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao Hu Liu | 2017-02-07 |
| 9410261 | Two mask process for electroplating metal employing a negative electrophoretic photoresist | Gerard McVicker, Anna Pratt | 2016-08-09 |
| 9340892 | Two mask process for electroplating metal employing a negative electrophoretic photoresist | Gerard McVicker, Anna Pratt | 2016-05-17 |
| 9263363 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Paul A. Lauro, Brian R. Sundlof, Jeffrey D. Gelorme | 2016-02-16 |
| 9040841 | Axiocentric scrubbing land grid array contacts and methods for fabrication | Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao Hu Liu | 2015-05-26 |
| 8959764 | Metallurgical clamshell methods for micro land grid array fabrication | Gerard McVicker, Xiaoxiong Gu | 2015-02-24 |
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Hsichang Liu +7 more | 2014-12-16 |
| 8846191 | Thermal expansion control employing platelet fillers | Xiao Hu Liu | 2014-09-30 |
| 8832936 | Method of forming metallized elastomeric electrical contacts | Ali Afzali, Steven A. Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma +4 more | 2014-09-16 |
| 8752284 | Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2014-06-17 |
| 8651877 | Metallurgical clamshell methods for micro land grid array fabrication | Gerard McVicker, Xiaoxiong Gu | 2014-02-18 |
| 8624152 | Negative coefficient thermal expansion engineered particles for composite fabrication | Vijayeshwar D. Khanna, Xiao Hu Liu, Gerard McVicker | 2014-01-07 |
| 8604623 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Paul A. Lauro, Brian R. Sundlof, Jeffrey D. Gelorme | 2013-12-10 |
| 8505200 | Land grid array interposer producing method | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2013-08-13 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Hsichang Liu +7 more | 2013-07-23 |
| 8479388 | Method of producing a land grid array interposer | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2013-07-09 |
| 8449971 | Thermal expansion control employing platelet fillers | Xiao Hu Liu | 2013-05-28 |
| 8341834 | Method of producing a land grid array (LGA) interposer structure | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2013-01-01 |
| 8316540 | Method of producing a land grid array (LGA) interposer structure | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-11-27 |
| 8278745 | Through board stacking of multiple LGA-connected components | Paul W. Coteus, Shawn A. Hall, Alphonso P. Lanzetta, Rick A. Rand | 2012-10-02 |
| 8268282 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Paul A. Lauro, Brian R. Sundlof, Jeffrey D. Gelorme | 2012-09-18 |
| 8263879 | Axiocentric scrubbing land grid array contacts and methods for fabrication | Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao Hu Liu | 2012-09-11 |
| 8241957 | Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2012-08-14 |
| 8191245 | Method of forming a land grid array (LGA) interposer | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-06-05 |
| 8174106 | Through board stacking of multiple LGA-connected components | Paul W. Coteus, Shawn A. Hall, Alphonso P. Lanzetta, Rick A. Rand | 2012-05-08 |