Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804442 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, John M. Cotte | 2023-10-31 |
| 11735802 | Electroplated metal layer on a niobium-titanium substrate | Ryan T. Gordon, Yu Luo, Robert L. Sandstrom | 2023-08-22 |
| 11676903 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, John M. Cotte | 2023-06-13 |
| 11131506 | Burst resistant thin wall heat sink | Paul W. Coteus, Mark D. Schultz, Todd E. Takken, Shurong Tian | 2021-09-28 |
| 10986753 | Water-assisted air cooling for a row of cabinet | — | 2021-04-20 |
| 10833436 | Interdigitated power connector | Paul W. Coteus, Andrew Ferencz, Todd E. Takken | 2020-11-10 |
| 10749817 | High-density, fail-in-place switches for computer and data networks | Paul W. Coteus, Fuad E. Doany, Mark D. Schultz, Todd E. Takken, Shurong Tian | 2020-08-18 |
| 10389654 | High-density, fail-in-place switches for computer and data networks | Paul W. Coteus, Fuad E. Doany, Mark D. Schultz, Todd E. Takken, Shurong Tian | 2019-08-20 |
| 10243285 | Low resistance, low-inductance power connectors | Paul W. Coteus, Andrew Ferencz, Todd E. Takken | 2019-03-26 |
| 10222125 | Burst resistant thin wall heat sink | Paul W. Coteus, Mark D. Schultz, Todd E. Takken, Shurong Tian | 2019-03-05 |
| 10215504 | Flexible cold plate with enhanced flexibility | Paul W. Coteus, Mark D. Schultz, Todd E. Takken, Shurong Tian | 2019-02-26 |
| 10068886 | Implementing inverted master-slave 3D semiconductor stack | Paul W. Coteus, Todd E. Takken | 2018-09-04 |
| 9971713 | Multi-petascale highly efficient parallel supercomputer | Sameh W. Asaad, Ralph E. Bellofatto, Michael A. Blocksome, Matthias A. Blumrich, Peter Boyle +54 more | 2018-05-15 |
| 9871310 | Low resistance, low-inductance power connectors | Paul W. Coteus, Andrew Ferencz, Todd E. Takken | 2018-01-16 |
| 9831783 | Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense | Paul W. Coteus, Andrew Ferencz, Todd E. Takken, Shurong Tian, Xin Zhang | 2017-11-28 |
| 9723760 | Water-assisted air cooling for a row of cabinets | — | 2017-08-01 |
| 9675508 | Apparatus for lifting a chair | — | 2017-06-13 |
| 9634959 | High-density, fail-in-place switches for computer and data networks | Paul W. Coteus, Fuad E. Doany, Mark D. Schultz, Todd E. Takken, Shurong Tian | 2017-04-25 |
| 9298395 | Memory system connector | Paul W. Coteus, Hillery C. Hunter, Douglas J. Joseph, Charles A. Kilmer, Kyu-hyoun Kim +2 more | 2016-03-29 |
| 9281302 | Implementing inverted master-slave 3D semiconductor stack | Paul W. Coteus, Todd E. Takken | 2016-03-08 |
| 9266704 | Mechanical linkage for lifting | — | 2016-02-23 |
| 9078796 | Apparatus for lifting a chair | — | 2015-07-14 |
| 9081501 | Multi-petascale highly efficient parallel supercomputer | Sameh W. Asaad, Ralph E. Bellofatto, Michael A. Blocksome, Matthias A. Blumrich, Peter Boyle +55 more | 2015-07-14 |
| 8899060 | Methods and apparatus for cooling electronics | Gerard V. Kopcsay | 2014-12-02 |
| 8278745 | Through board stacking of multiple LGA-connected components | Paul W. Coteus, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand | 2012-10-02 |