Issued Patents All Time
Showing 25 most recent of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324361 | Electrical connections between dissimilar materials at cryogenic temperatures | John M. Cotte, Nicholas A. Masluk | 2025-06-03 |
| 12249748 | Edge capacitive coupling for quantum chips | Muir Kumph, Oliver Dial, John M. Cotte | 2025-03-11 |
| 12150390 | Downstop and bump bonds formation on substrates | John M. Cotte | 2024-11-19 |
| 12033981 | Create a protected layer for interconnects and devices in a packaged quantum structure | Oliver Dial, John M. Cotte, Kevin S. Petrarca | 2024-07-09 |
| 11908756 | Interposer chips and enclosures for quantum circuits | John M. Cotte | 2024-02-20 |
| 11804442 | Combined backing plate and housing for use in bump bonded chip assembly | John M. Cotte, Shawn A. Hall | 2023-10-31 |
| 11676903 | Combined backing plate and housing for use in bump bonded chip assembly | John M. Cotte, Shawn A. Hall | 2023-06-13 |
| 11411158 | Offset embedded ground plane cutout | Timothy Phung | 2022-08-09 |
| 11206739 | Potting method | Stuart Waller | 2021-12-21 |
| 11067475 | Bedload transport methodology and method of use | Tate O McAlpin, John Shelley, Thad C Pratt | 2021-07-20 |
| 10937941 | Mechanically tunable superconducting qubit | Jerry M. Chow, Jay M. Gambetta, John A. Smolin | 2021-03-02 |
| 10833016 | Semiconductor device including superconducting metal through-silicon-vias and method of making the same | John M. Cotte | 2020-11-10 |
| 10756410 | Coaxial transmission line slot filter with absorptive matrix | Antonio D. Corcoles Gonzalez, James R. Rozen | 2020-08-25 |
| 10734567 | Bump bonded cryogenic chip carrier | John M. Cotte, Mary B. Rothwell | 2020-08-04 |
| 10727391 | Bump bonded cryogenic chip carrier | John M. Cotte, Mary B. Rothwell | 2020-07-28 |
| 10727192 | Multiple sized bump bonds | John M. Cotte | 2020-07-28 |
| 10651099 | Non-destructive testing of integrated circuit chips | John M. Cotte | 2020-05-12 |
| 10629797 | Two-component bump metallization | John M. Cotte, Eric P. Lewandowski | 2020-04-21 |
| 10608158 | Two-component bump metallization | John M. Cotte, Eric P. Lewandowski | 2020-03-31 |
| 10504842 | Semiconductor device including superconducting metal through-silicon-vias | John M. Cotte | 2019-12-10 |
| 10380494 | Josephson junctions for improved qubits | Josephine B. Chang, Jay M. Gambetta | 2019-08-13 |
| 10347600 | Through-substrate-vias with self-aligned solder bumps | John M. Cotte | 2019-07-09 |
| 10325870 | Through-substrate-vias with self-aligned solder bumps | John M. Cotte | 2019-06-18 |
| 10268968 | Josephson junctions for improved qubits | Josephine B. Chang, Jay M. Gambetta | 2019-04-23 |
| 10170680 | Qubits by selective laser-modulated deposition | Jay M. Gambetta, Mary B. Rothwell | 2019-01-01 |