| 12324361 |
Electrical connections between dissimilar materials at cryogenic temperatures |
John M. Cotte, Nicholas A. Masluk |
2025-06-03 |
|
| 12249748 |
Edge capacitive coupling for quantum chips |
Muir Kumph, Oliver Dial, John M. Cotte |
2025-03-11 |
|
| 12150390 |
Downstop and bump bonds formation on substrates |
John M. Cotte |
2024-11-19 |
$17,641,000 |
| 12033981 |
Create a protected layer for interconnects and devices in a packaged quantum structure |
Oliver Dial, John M. Cotte, Kevin S. Petrarca |
2024-07-09 |
$16,648,000 |
| 11908756 |
Interposer chips and enclosures for quantum circuits |
John M. Cotte |
2024-02-20 |
$7,691,000 |
| 11804442 |
Combined backing plate and housing for use in bump bonded chip assembly |
John M. Cotte, Shawn A. Hall |
2023-10-31 |
$8,788,000 |
| 11676903 |
Combined backing plate and housing for use in bump bonded chip assembly |
John M. Cotte, Shawn A. Hall |
2023-06-13 |
$5,486,000 |
| 11411158 |
Offset embedded ground plane cutout |
Timothy Phung |
2022-08-09 |
$6,406,000 |
| 11206739 |
Potting method |
Stuart Waller |
2021-12-21 |
|
| 11067475 |
Bedload transport methodology and method of use |
Tate O McAlpin, John Shelley, Thad C Pratt |
2021-07-20 |
|
| 10937941 |
Mechanically tunable superconducting qubit |
Jerry M. Chow, Jay M. Gambetta, John A. Smolin |
2021-03-02 |
$2,720,000 |
| 10833016 |
Semiconductor device including superconducting metal through-silicon-vias and method of making the same |
John M. Cotte |
2020-11-10 |
$848,000 |
| 10756410 |
Coaxial transmission line slot filter with absorptive matrix |
Antonio D. Corcoles Gonzalez, James R. Rozen |
2020-08-25 |
$2,454,000 |
| 10734567 |
Bump bonded cryogenic chip carrier |
John M. Cotte, Mary B. Rothwell |
2020-08-04 |
$3,150,000 |
| 10727192 |
Multiple sized bump bonds |
John M. Cotte |
2020-07-28 |
$3,400,000 |
| 10727391 |
Bump bonded cryogenic chip carrier |
John M. Cotte, Mary B. Rothwell |
2020-07-28 |
$3,400,000 |
| 10651099 |
Non-destructive testing of integrated circuit chips |
John M. Cotte |
2020-05-12 |
$2,725,000 |
| 10629797 |
Two-component bump metallization |
John M. Cotte, Eric P. Lewandowski |
2020-04-21 |
$2,793,000 |
| 10608158 |
Two-component bump metallization |
John M. Cotte, Eric P. Lewandowski |
2020-03-31 |
$1,667,000 |
| 10504842 |
Semiconductor device including superconducting metal through-silicon-vias |
John M. Cotte |
2019-12-10 |
$5,388,000 |
| 10380494 |
Josephson junctions for improved qubits |
Josephine B. Chang, Jay M. Gambetta |
2019-08-13 |
$1,909,000 |
| 10347600 |
Through-substrate-vias with self-aligned solder bumps |
John M. Cotte |
2019-07-09 |
$2,201,000 |
| 10325870 |
Through-substrate-vias with self-aligned solder bumps |
John M. Cotte |
2019-06-18 |
$3,033,000 |
| 10268968 |
Josephson junctions for improved qubits |
Josephine B. Chang, Jay M. Gambetta |
2019-04-23 |
$3,141,000 |
| 10170680 |
Qubits by selective laser-modulated deposition |
Jay M. Gambetta, Mary B. Rothwell |
2019-01-01 |
|
