Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107065 | Uniform chip gaps via injection-molded solder pillars | Jae-Woong Nah, Dongbing Shao | 2024-10-01 |
| 11990437 | System and method for forming solder bumps | Jae-Woong Nah, Jeng-Bang Yau, Peter J. Sorce | 2024-05-21 |
| 11895932 | Selective chemical frequency modification of Josephson junction resonators | Jeng-Bang Yau, Eric Zhang, Bucknell C. Webb | 2024-02-06 |
| 11766729 | Molten solder injection head with vacuum filter and differential gauge system | Jae-Woong Nah, John U. Knickerbocker | 2023-09-26 |
| 11749605 | Hybrid under-bump metallization component | Jae-Woong Nah, Adinath S. Narasgond | 2023-09-05 |
| 11258132 | Microbattery separator | Paul S. Andry, Adam Toner, Daniel B. Otts, James Daniel Riall, Cornelia Tsang Yang | 2022-02-22 |
| 11195799 | Hybrid readout package for quantum multichip bonding | Dongbing Shao, Nicholas Torleiv Bronn, Markus Brink | 2021-12-07 |
| 11165010 | Cold-welded flip chip interconnect structure | Jae-Woong Nah, Nicholas Torleiv Bronn | 2021-11-02 |
| 11158781 | Permanent wafer handlers with through silicon vias for thermalization and qubit modification | Jae-Woong Nah, Li-Wen Hung, Adinath S. Narasgond | 2021-10-26 |
| 11043690 | Sandwich-parallel micro-battery | Jae-Woong Nah, Paul S. Andry, Bucknell C. Webb, Adinath S. Narasgond, Bo Wen | 2021-06-22 |
| 10937735 | Hybrid under-bump metallization component | Jae-Woong Nah, Adinath S. Narasgond | 2021-03-02 |
| 10881788 | Delivery device including reactive material for programmable discrete delivery of a substance | Bing Dang, Gregory M. Fritz, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2021-01-05 |
| 10879202 | System and method for forming solder bumps | Jae-Woong Nah, Jeng-Bang Yau, Peter J. Sorce | 2020-12-29 |
| 10833241 | Thermalization structure for cryogenic temperature devices | Bucknell C. Webb, Jared Barney Hertzberg, Martin O. Sandberg, Oblesh Jinka | 2020-11-10 |
| 10692831 | Stud bumps for post-measurement qubit frequency modification | Nicholas Torleiv Bronn, Jared Barney Hertzberg, Jae-Woong Nah | 2020-06-23 |
| 10686164 | Cathode for thin film microbattery | Paul S. Andry, Yu Luo, Adinath S. Narasgond | 2020-06-16 |
| 10629797 | Two-component bump metallization | David W. Abraham, John M. Cotte | 2020-04-21 |
| 10622590 | Method of forming a homogeneous solid metallic anode for a thin film microbattery | Paul S. Andry, Gregory M. Fritz, Michael S. Gordon, Yu Luo | 2020-04-14 |
| 10608158 | Two-component bump metallization | David W. Abraham, John M. Cotte | 2020-03-31 |
| 10535592 | Method for forming solder bumps using sacrificial layer | Jae-Woong Nah, Peter J. Sorce | 2020-01-14 |
| 10388929 | Microbattery separator | Paul S. Andry, Adam Toner, Daniel B. Otts, James Daniel Riall, Cornelia Tsang Yang | 2019-08-20 |
| 10096802 | Homogeneous solid metallic anode for thin film microbattery | Paul S. Andry, Gregory M. Fritz, Michael S. Gordon, Yu Luo | 2018-10-09 |
| 10069116 | Cathode for thin film microbattery | Paul S. Andry, Yu Luo, Adinath S. Narasgond | 2018-09-04 |
| 9953908 | Method for forming solder bumps using sacrificial layer | Jae-Woong Nah, Peter J. Sorce | 2018-04-24 |
| 9806299 | Cathode for thin film microbattery | Paul S. Andry, Yu Luo, Adinath S. Narasgond | 2017-10-31 |