| 12506137 |
High capacity compact lithium thin film battery |
Paul S. Andry, Dana Alexa Totir |
2025-12-23 |
|
| 12107065 |
Uniform chip gaps via injection-molded solder pillars |
Jae-Woong Nah, Dongbing Shao |
2024-10-01 |
$16,240,000 |
| 11990437 |
System and method for forming solder bumps |
Jae-Woong Nah, Jeng-Bang Yau, Peter J. Sorce |
2024-05-21 |
$15,464,000 |
| 11895932 |
Selective chemical frequency modification of Josephson junction resonators |
Jeng-Bang Yau, Eric Zhang, Bucknell C. Webb |
2024-02-06 |
$12,408,000 |
| 11766729 |
Molten solder injection head with vacuum filter and differential gauge system |
Jae-Woong Nah, John U. Knickerbocker |
2023-09-26 |
$8,116,000 |
| 11749605 |
Hybrid under-bump metallization component |
Jae-Woong Nah, Adinath S. Narasgond |
2023-09-05 |
$6,576,000 |
| 11258132 |
Microbattery separator |
Paul S. Andry, Adam Toner, Daniel B. Otts, James Daniel Riall, Cornelia Tsang Yang |
2022-02-22 |
$13,349,000 |
| 11195799 |
Hybrid readout package for quantum multichip bonding |
Dongbing Shao, Nicholas Torleiv Bronn, Markus Brink |
2021-12-07 |
$3,115,000 |
| 11165010 |
Cold-welded flip chip interconnect structure |
Jae-Woong Nah, Nicholas Torleiv Bronn |
2021-11-02 |
$2,126,000 |
| 11158781 |
Permanent wafer handlers with through silicon vias for thermalization and qubit modification |
Jae-Woong Nah, Li-Wen Hung, Adinath S. Narasgond |
2021-10-26 |
$2,874,000 |
| 11043690 |
Sandwich-parallel micro-battery |
Jae-Woong Nah, Paul S. Andry, Bucknell C. Webb, Adinath S. Narasgond, Bo Wen |
2021-06-22 |
$6,016,000 |
| 10937735 |
Hybrid under-bump metallization component |
Jae-Woong Nah, Adinath S. Narasgond |
2021-03-02 |
$2,720,000 |
| 10881788 |
Delivery device including reactive material for programmable discrete delivery of a substance |
Bing Dang, Gregory M. Fritz, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright |
2021-01-05 |
$2,293,000 |
| 10879202 |
System and method for forming solder bumps |
Jae-Woong Nah, Jeng-Bang Yau, Peter J. Sorce |
2020-12-29 |
$5,669,000 |
| 10833241 |
Thermalization structure for cryogenic temperature devices |
Bucknell C. Webb, Jared Barney Hertzberg, Martin O. Sandberg, Oblesh Jinka |
2020-11-10 |
$848,000 |
| 10692831 |
Stud bumps for post-measurement qubit frequency modification |
Nicholas Torleiv Bronn, Jared Barney Hertzberg, Jae-Woong Nah |
2020-06-23 |
$2,380,000 |
| 10686164 |
Cathode for thin film microbattery |
Paul S. Andry, Yu Luo, Adinath S. Narasgond |
2020-06-16 |
$3,682,000 |
| 10629797 |
Two-component bump metallization |
David W. Abraham, John M. Cotte |
2020-04-21 |
$2,793,000 |
| 10622590 |
Method of forming a homogeneous solid metallic anode for a thin film microbattery |
Paul S. Andry, Gregory M. Fritz, Michael S. Gordon, Yu Luo |
2020-04-14 |
$1,668,000 |
| 10608158 |
Two-component bump metallization |
David W. Abraham, John M. Cotte |
2020-03-31 |
$1,667,000 |
| 10535592 |
Method for forming solder bumps using sacrificial layer |
Jae-Woong Nah, Peter J. Sorce |
2020-01-14 |
$2,827,000 |
| 10388929 |
Microbattery separator |
Paul S. Andry, Adam Toner, Daniel B. Otts, James Daniel Riall, Cornelia Tsang Yang |
2019-08-20 |
$1,949,000 |
| 10096802 |
Homogeneous solid metallic anode for thin film microbattery |
Paul S. Andry, Gregory M. Fritz, Michael S. Gordon, Yu Luo |
2018-10-09 |
$3,566,000 |
| 10069116 |
Cathode for thin film microbattery |
Paul S. Andry, Yu Luo, Adinath S. Narasgond |
2018-09-04 |
$2,923,000 |
| 9953908 |
Method for forming solder bumps using sacrificial layer |
Jae-Woong Nah, Peter J. Sorce |
2018-04-24 |
$2,845,000 |
