| 12183702 |
Electronic package with varying interconnects |
Kamal K. Sikka, Charles L. Arvin, Thomas E. Lombardi, Piyas Bal Chowdhury, Alfred Grill |
2024-12-31 |
$22,533,000 |
| 12119335 |
Interconnection structures for high bandwidth data transfer |
Joshua M. Rubin, Arvind Kumar, Mounir Meghelli |
2024-10-15 |
$17,235,000 |
| 11600479 |
System and method for detecting analytes dissolved in liquids by plasma ionisation mass spectrometry |
Eric Yeatman, Edward Crichton |
2023-03-07 |
|
| 11587896 |
Transferrable pillar structure for fanout package or interconnect bridge |
Joshua M. Rubin, Yang Liu, Paul S. Andry |
2023-02-21 |
$5,683,000 |
| 11574875 |
Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers |
Joshua M. Rubin, Lawrence A. Clevenger |
2023-02-07 |
$6,435,000 |
| 11534585 |
Fluid delivery device with hydrophobic surface |
Yang Liu |
2022-12-27 |
$9,721,000 |
| 11164817 |
Multi-chip package structures with discrete redistribution layers |
Joshua M. Rubin, Kamal K. Sikka, Lawrence A. Clevenger |
2021-11-02 |
$2,126,000 |
| 11133259 |
Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network |
Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Wiren D. Becker, Xiao Hu Liu |
2021-09-28 |
$6,479,000 |
| 11114410 |
Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices |
Joshua M. Rubin, Lawrence A. Clevenger |
2021-09-07 |
$7,685,000 |
| 11094637 |
Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers |
Joshua M. Rubin, Lawrence A. Clevenger |
2021-08-17 |
$3,119,000 |
| 11000474 |
Microchip substance delivery devices |
S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more |
2021-05-11 |
$6,417,000 |
| 10940265 |
Drug delivery device having a cavity sealed by a pressurized membrane |
Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb |
2021-03-09 |
$4,710,000 |
| 10881788 |
Delivery device including reactive material for programmable discrete delivery of a substance |
Bing Dang, Gregory M. Fritz, Eric P. Lewandowski, Joana S. B. T. Maria, Bucknell C. Webb |
2021-01-05 |
$2,293,000 |
| 10638945 |
Transdermal sensing probes and smart patch systems using same |
Bing Dang, Yang Liu |
2020-05-05 |
$3,712,000 |
| 10585119 |
Integrated self-coining probe |
Yang Liu |
2020-03-10 |
$1,254,000 |
| 10508755 |
Fluid delivery device with hydrophobic surface |
Yang Liu |
2019-12-17 |
$8,615,000 |
| 10396220 |
Device layer thin-film transfer to thermally conductive substrate |
Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang |
2019-08-27 |
$1,335,000 |
| 10330701 |
Test probe head for full wafer testing |
Bing Dang, Yu Luo, John U. Knickerbocker, Yang Liu |
2019-06-25 |
$2,152,000 |
| 10314970 |
Drug delivery device having a cavity sealed by a pressurized membrane |
Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb |
2019-06-11 |
$1,829,000 |
| 10243091 |
Device layer thin-film transfer to thermally conductive substrate |
Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang |
2019-03-26 |
$2,148,000 |
| 10032943 |
Device layer thin-film transfer to thermally conductive substrate |
Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang |
2018-07-24 |
$2,645,000 |
| 10001508 |
Integrated self-coining probe |
Yang Liu |
2018-06-19 |
$3,279,000 |
| 9937124 |
Microchip substance delivery devices having low-power electromechanical release mechanisms |
S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more |
2018-04-10 |
$2,135,000 |
| 9867932 |
Drug delivery device having a cavity sealed by a pressurized membrane |
Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb |
2018-01-16 |
$4,196,000 |
| 9865569 |
Planarity-tolerant reworkable interconnect with integrated testing |
Bing Dang, John U. Knickerbocker, Yang Liu, Yu Luo |
2018-01-09 |
$3,907,000 |