Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
SW

Steven L. Wright — 69 Patents

IBM: 54 patents #1,525 of 70,183Top 3%
MPMicrosaic Systems Plc: 7 patents #1 of 15Top 7%
Pioneer (Corteva): 5 patents #563 of 1,537Top 40%
MLMicrosaic Systems Limited: 1 patents #4 of 5Top 80%
TETextron: 1 patents #316 of 152Top 210%
ADAnalog Devices: 1 patents #1,569 of 1,990Top 80%
Somers, NY: #9 of 237 inventorsTop 4%
New York: #1,108 of 115,490 inventorsTop 1%
Overall (All Time): #29,979 of 4,157,543Top 1%
69 Patents All Time
Steven L. Wright has been granted 69 US patents while listed as an inventor at IBM. The first was granted in 1985 and the most recent in December 2024. Steven L. Wright ranks #29,979 of 4,157,543 US inventors in our database (top 0.72%). Patent records list Steven L. Wright in Somers, NY, US.

Issued Patents All Time

Showing 1–25 of 69 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12183702 Electronic package with varying interconnects Kamal K. Sikka, Charles L. Arvin, Thomas E. Lombardi, Piyas Bal Chowdhury, Alfred Grill 2024-12-31 $22,533,000
12119335 Interconnection structures for high bandwidth data transfer Joshua M. Rubin, Arvind Kumar, Mounir Meghelli 2024-10-15 $17,235,000
11600479 System and method for detecting analytes dissolved in liquids by plasma ionisation mass spectrometry Eric Yeatman, Edward Crichton 2023-03-07
11587896 Transferrable pillar structure for fanout package or interconnect bridge Joshua M. Rubin, Yang Liu, Paul S. Andry 2023-02-21 $5,683,000
11574875 Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers Joshua M. Rubin, Lawrence A. Clevenger 2023-02-07 $6,435,000
11534585 Fluid delivery device with hydrophobic surface Yang Liu 2022-12-27 $9,721,000
11164817 Multi-chip package structures with discrete redistribution layers Joshua M. Rubin, Kamal K. Sikka, Lawrence A. Clevenger 2021-11-02 $2,126,000
11133259 Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Wiren D. Becker, Xiao Hu Liu 2021-09-28 $6,479,000
11114410 Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices Joshua M. Rubin, Lawrence A. Clevenger 2021-09-07 $7,685,000
11094637 Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers Joshua M. Rubin, Lawrence A. Clevenger 2021-08-17 $3,119,000
11000474 Microchip substance delivery devices S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more 2021-05-11 $6,417,000
10940265 Drug delivery device having a cavity sealed by a pressurized membrane Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb 2021-03-09 $4,710,000
10881788 Delivery device including reactive material for programmable discrete delivery of a substance Bing Dang, Gregory M. Fritz, Eric P. Lewandowski, Joana S. B. T. Maria, Bucknell C. Webb 2021-01-05 $2,293,000
10638945 Transdermal sensing probes and smart patch systems using same Bing Dang, Yang Liu 2020-05-05 $3,712,000
10585119 Integrated self-coining probe Yang Liu 2020-03-10 $1,254,000
10508755 Fluid delivery device with hydrophobic surface Yang Liu 2019-12-17 $8,615,000
10396220 Device layer thin-film transfer to thermally conductive substrate Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang 2019-08-27 $1,335,000
10330701 Test probe head for full wafer testing Bing Dang, Yu Luo, John U. Knickerbocker, Yang Liu 2019-06-25 $2,152,000
10314970 Drug delivery device having a cavity sealed by a pressurized membrane Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb 2019-06-11 $1,829,000
10243091 Device layer thin-film transfer to thermally conductive substrate Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang 2019-03-26 $2,148,000
10032943 Device layer thin-film transfer to thermally conductive substrate Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang 2018-07-24 $2,645,000
10001508 Integrated self-coining probe Yang Liu 2018-06-19 $3,279,000
9937124 Microchip substance delivery devices having low-power electromechanical release mechanisms S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more 2018-04-10 $2,135,000
9867932 Drug delivery device having a cavity sealed by a pressurized membrane Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb 2018-01-16 $4,196,000
9865569 Planarity-tolerant reworkable interconnect with integrated testing Bing Dang, John U. Knickerbocker, Yang Liu, Yu Luo 2018-01-09 $3,907,000