Issued Patents All Time
Showing 25 most recent of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183702 | Electronic package with varying interconnects | Kamal K. Sikka, Charles L. Arvin, Thomas E. Lombardi, Piyas Bal Chowdhury, Alfred Grill | 2024-12-31 |
| 12119335 | Interconnection structures for high bandwidth data transfer | Joshua M. Rubin, Arvind Kumar, Mounir Meghelli | 2024-10-15 |
| 11600479 | System and method for detecting analytes dissolved in liquids by plasma ionisation mass spectrometry | Eric Yeatman, Edward Crichton | 2023-03-07 |
| 11587896 | Transferrable pillar structure for fanout package or interconnect bridge | Joshua M. Rubin, Yang Liu, Paul S. Andry | 2023-02-21 |
| 11574875 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Joshua M. Rubin, Lawrence A. Clevenger | 2023-02-07 |
| 11534585 | Fluid delivery device with hydrophobic surface | Yang Liu | 2022-12-27 |
| 11164817 | Multi-chip package structures with discrete redistribution layers | Joshua M. Rubin, Kamal K. Sikka, Lawrence A. Clevenger | 2021-11-02 |
| 11133259 | Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network | Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Wiren D. Becker, Xiao Hu Liu | 2021-09-28 |
| 11114410 | Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices | Joshua M. Rubin, Lawrence A. Clevenger | 2021-09-07 |
| 11094637 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Joshua M. Rubin, Lawrence A. Clevenger | 2021-08-17 |
| 11000474 | Microchip substance delivery devices | S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more | 2021-05-11 |
| 10940265 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb | 2021-03-09 |
| 10881788 | Delivery device including reactive material for programmable discrete delivery of a substance | Bing Dang, Gregory M. Fritz, Eric P. Lewandowski, Joana S. B. T. Maria, Bucknell C. Webb | 2021-01-05 |
| 10638945 | Transdermal sensing probes and smart patch systems using same | Bing Dang, Yang Liu | 2020-05-05 |
| 10585119 | Integrated self-coining probe | Yang Liu | 2020-03-10 |
| 10508755 | Fluid delivery device with hydrophobic surface | Yang Liu | 2019-12-17 |
| 10396220 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang | 2019-08-27 |
| 10330701 | Test probe head for full wafer testing | Bing Dang, Yu Luo, John U. Knickerbocker, Yang Liu | 2019-06-25 |
| 10314970 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb | 2019-06-11 |
| 10243091 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang | 2019-03-26 |
| 10032943 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, John U. Knickerbocker, Cornelia Tsang Yang | 2018-07-24 |
| 10001508 | Integrated self-coining probe | Yang Liu | 2018-06-19 |
| 9937124 | Microchip substance delivery devices having low-power electromechanical release mechanisms | S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more | 2018-04-10 |
| 9867932 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb | 2018-01-16 |
| 9865569 | Planarity-tolerant reworkable interconnect with integrated testing | Bing Dang, John U. Knickerbocker, Yang Liu, Yu Luo | 2018-01-09 |