Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11529627 | Layered silicon and stacking of microfluidic chips | Joshua T. Smith, Benjamin H. Wunsch | 2022-12-20 |
| 11258132 | Microbattery separator | Paul S. Andry, Eric P. Lewandowski, Adam Toner, Daniel B. Otts, James Daniel Riall | 2022-02-22 |
| 11121005 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2021-09-14 |
| 10702866 | Layered silicon and stacking of microfluidic chips | Joshua T. Smith, Benjamin H. Wunsch | 2020-07-07 |
| 10679887 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-06-09 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-03-10 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-02-25 |
| 10388929 | Microbattery separator | Paul S. Andry, Eric P. Lewandowski, Adam Toner, Daniel B. Otts, James Daniel Riall | 2019-08-20 |
| 10325785 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-06-18 |
| 10276439 | Rapid oxide etch for manufacturing through dielectric via structures | Sebastian U. Engelmann, Li-Wen Hung, Eric A. Joseph, Eugene J. O'Sullivan, Jeff Waksman | 2019-04-30 |
| 10232372 | Integrated nanofluidic arrays for high capacity colloid separation | Joshua T. Smith, Benjamin H. Wunsch | 2019-03-19 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-03-05 |
| 10032943 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, John U. Knickerbocker, Steven L. Wright | 2018-07-24 |
| 9947570 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2018-04-17 |
| 9876200 | All-silicon hermetic package and processing for narrow, low-profile microbatteries | Paul S. Andry, Bucknell C. Webb | 2018-01-23 |
| 9833782 | Integrated nanofluidic arrays for high capacity colloid separation | Joshua T. Smith, Benjamin H. Wunsch | 2017-12-05 |
| 9700891 | Integrated nanofluidic arrays for high capacity colloid separation | Joshua T. Smith, Benjamin H. Wunsch | 2017-07-11 |