Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12329044 | Applying inert ion beam etching for improving a profile and repairing sidewall damage for phase change memory devices | Luxherta Buzi, Thitima Suwannasiri, Lynne M. Gignac, Robert L. Bruce | 2025-06-10 |
| 12057322 | Methods for etching metal films using plasma processing | Nicholas Joy, Devi Koty, Qingyun Yang, Nathan P. Marchack | 2024-08-06 |
| 11270893 | Layer-by-layer etching of poly-granular metal-based materials for semiconductor structures | John M. Papalia, Hiroyuki Miyazoe, Nathan P. Marchack | 2022-03-08 |
| 11018225 | III-V extension by high temperature plasma doping | Robert L. Bruce, Kevin K. Chan, Renee T. Mo, Christopher Scerbo, Hongwen Yan +1 more | 2021-05-25 |
| 10714341 | Reactive ion etching assisted lift-off processes for fabricating thick metallization patterns with tight pitch | Guy M. Cohen, Steve Holmes, Jyotica V. Patel | 2020-07-14 |
| 10651286 | High selectivity nitride removal process based on selective polymer deposition | Ravi K. Dasaka, Nicholas C. M. Fuller, Masahiro Nakamura, Richard S. Wise | 2020-05-12 |
| 10529633 | Method of integrated circuit (IC) chip fabrication | Eric A. Joseph | 2020-01-07 |
| 10366918 | Self-aligned trench metal-alloying for III-V nFETs | Kevin K. Chan, Marinus Hopstaken, Christopher Scerbo, Hongwen Yan, Yu Zhu | 2019-07-30 |
| 10325998 | High selectivity nitride removal process based on selective polymer deposition | Ravi K. Dasaka, Nicholas C. M. Fuller, Masahiro Nakamura, Richard S. Wise | 2019-06-18 |
| 10304692 | Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits | John C. Arnold, Robert L. Bruce, Nathan P. Marchack, Hiroyuki Miyazoe, Jeffrey C. Shearer +1 more | 2019-05-28 |
| 10305029 | Image reversal process for tight pitch pillar arrays | Nathan P. Marchack, Masahiro Nakamura | 2019-05-28 |
| 10276439 | Rapid oxide etch for manufacturing through dielectric via structures | Li-Wen Hung, Eric A. Joseph, Eugene J. O'Sullivan, Jeff Waksman, Cornelia Tsang Yang | 2019-04-30 |
| 10276384 | Plasma shallow doping and wet removal of depth control cap | Robert L. Bruce, Kevin K. Chan, Dario L. Goldfarb, Marinus Hopstaken, Mahmoud Khojasteh +3 more | 2019-04-30 |
| 10269924 | High selectivity nitride removal process based on selective polymer deposition | Ravi K. Dasaka, Nicholas C. M. Fuller, Masahiro Nakamura, Richard S. Wise | 2019-04-23 |
| 10167443 | Wet clean process for removing CxHyFz etch residue | Robert L. Bruce, Eric A. Joseph, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more | 2019-01-01 |
| 10043668 | Selective dry etch for directed self assembly of block copolymers | Ashish Jagtiani, Hiroyuki Miyazoe, HsinYu Tsai | 2018-08-07 |
| 9941121 | Selective dry etch for directed self assembly of block copolymers | Ashish Jagtiani, Hiroyuki Miyazoe, HsinYu Tsai | 2018-04-10 |
| 9891189 | Techniques for fabricating horizontally aligned nanochannels for microfluidics and biosensors | Stephen M. Rossnagel, Ying Zhang | 2018-02-13 |
| 9881793 | Neutral hard mask and its application to graphoepitaxy-based directed self-assembly (DSA) patterning | Mahmoud Khojasteh, Deborah A. Neumayer, John M. Papalia, HsinYu Tsai | 2018-01-30 |
| 9728444 | Reactive ion etching assisted lift-off processes for fabricating thick metallization patterns with tight pitch | Guy M. Cohen, Steve Holmes, Jyotica V. Patel | 2017-08-08 |
| 9728421 | High aspect ratio patterning of hard mask materials by organic soft masks | Markus Brink, Eric A. Joseph, Hiroyuki Miyazoe | 2017-08-08 |
| 9691972 | Low temperature encapsulation for magnetic tunnel junction | Anthony J. Annunziata, Eric A. Joseph, Gen P. Lauer, Nathan P. Marchack, Deborah A. Neumayer +1 more | 2017-06-27 |
| 9643179 | Techniques for fabricating horizontally aligned nanochannels for microfluidics and biosensors | Stephen M. Rossnagel, Ying Zhang | 2017-05-09 |
| 9633948 | Low energy etch process for nitrogen-containing dielectric layer | Markus Brink, Robert L. Bruce, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura | 2017-04-25 |
| 9627533 | High selectivity nitride removal process based on selective polymer deposition | Ravi K. Dasaka, Nicholas C. M. Fuller, Masahiro Nakamura, Richard S. Wise | 2017-04-18 |