SE

Sebastian U. Engelmann

IBM: 37 patents #2,596 of 70,183Top 4%
ZE Zeon: 9 patents #68 of 734Top 10%
Globalfoundries: 4 patents #817 of 4,424Top 20%
TL Tokyo Electron Limited: 2 patents #2,602 of 5,567Top 50%
GU Globalfoundries U.S.: 2 patents #5 of 211Top 3%
ET Elpis Technologies: 1 patents #31 of 121Top 30%
📍 White Plains, NY: #40 of 917 inventorsTop 5%
🗺 New York: #2,285 of 115,490 inventorsTop 2%
Overall (All Time): #67,002 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 26–44 of 44 patents

Patent #TitleCo-InventorsDate
9536731 Wet clean process for removing CxHyFz etch residue Robert L. Bruce, Eric A. Joseph, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more 2017-01-03
9490164 Techniques for forming contacts for active BEOL Steve Holmes, Qinghuang Lin, Nathan P. Marchack, Eugene J. O'Sullivan 2016-11-08
9437443 Low-temperature sidewall image transfer process using ALD metals, metal oxides and metal nitrides Markus Brink, Michael A. Guillorn, Hiroyuki Miyazoe, Adam M. Pyzyna, Jeffrey W. Sleight 2016-09-06
9299639 Patterning transition metals in integrated circuits Cyril Cabral, Jr., Benjamin L. Fletcher, Michael S. Gordon, Eric A. Joseph 2016-03-29
9299638 Patterning transition metals in integrated circuits Cyril Cabral, Jr., Benjamin L. Fletcher, Michael S. Gordon, Eric A. Joseph 2016-03-29
9214355 Molecular radical etch chemistry for increased throughput in pulsed plasma applications Nathan P. Marchack, Masahiro Nakamura 2015-12-15
9190316 Low energy etch process for nitrogen-containing dielectric layer Markus Brink, Robert L. Bruce, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura 2015-11-17
9162877 Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration Josephine B. Chang, Leland Chang, Michael A. Guillorn 2015-10-20
9018090 Borderless self-aligned metal contact patterning using printable dielectric materials Josephine B. Chang, Nicholas C. M. Fuller, Michael A. Guillorn, Eric A. Joseph, Adam M. Pyzyna 2015-04-28
9000556 Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration Josephine B. Chang, Leland Chang, Michael A. Guillorn 2015-04-07
8916054 High fidelity patterning employing a fluorohydrocarbon-containing polymer Markus Brink, Nicholas C. M. Fuller, Michael A. Guillorn, Hiroyuki Miyazoe, Masahiro Nakamura 2014-12-23
8829625 Nanowire FET with trapezoid gate structure Jeffrey W. Sleight, Sarunya Bangsaruntip, Ying Zhang 2014-09-09
8765613 High selectivity nitride etch process Josephine B. Chang, Nicholas C. M. Fuller, Michael A. Guillorn, Masahiro Nakamura 2014-07-01
8658050 Method to transfer lithographic patterns into inorganic substrates Martin Glodde, Michael A. Guillorn 2014-02-25
8445948 Gate patterning of nano-channel devices Nicholas C. M. Fuller, Sarunya Bangsaruntip, Guy M. Cohen, Lidija Sekaric, Qingyun Yang +1 more 2013-05-21
8431486 Interconnect structure for improved time dependent dielectric breakdown Cyril Cabral, Jr., Benjamin L. Fletcher, Eric A. Joseph, Satyanarayana V. Nitta 2013-04-30
8298881 Nanowire FET with trapezoid gate structure Jeffrey W. Sleight, Sarunya Bangsaruntip, Ying Zhang 2012-10-30
8232171 Structure with isotropic silicon recess profile in nanoscale dimensions Nicholas C. M. Fuller, Eric A. Joseph, Isaac Lauer, Ryan M. Martin, James Vichiconti +1 more 2012-07-31
7816275 Gate patterning of nano-channel devices Nicholas C. M. Fuller, Sarunya Bangsaruntip, Guy M. Cohen, Lidija Sekaric, Qingyun Yang +1 more 2010-10-19