| 11915926 |
Percolation doping of inorganic-organic frameworks for multiple device applications |
Leonidas E. Ocola, Hiroyuki Miyazoe, Takashi Ando, Damon B. Farmer |
2024-02-27 |
$9,833,000 |
| 10727114 |
Interconnect structure including airgaps and substractively etched metal lines |
Robert L. Bruce, Alfred Grill, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Deborah A. Neumayer |
2020-07-28 |
$3,400,000 |
| 10727121 |
Thin film interconnects with large grains |
Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Michael F. Lofaro, Hiroyuki Miyazoe +2 more |
2020-07-28 |
|
| 10643859 |
Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication |
Robert L. Bruce, Joe Lee, Takefumi Suzuki |
2020-05-05 |
$3,712,000 |
| 10607899 |
Nano deposition and ablation for the repair and fabrication of integrated circuits |
Shawn A. Adderly, Jeffrey P. Gambino, Anthony C. Speranza |
2020-03-31 |
$1,667,000 |
| 10600656 |
Directed self-assembly for copper patterning |
Hiroyuki Miyazoe, Adam M. Pyzyna, HsinYu Tsai |
2020-03-24 |
$1,716,000 |
| 10529633 |
Method of integrated circuit (IC) chip fabrication |
Sebastian U. Engelmann |
2020-01-07 |
$1,754,000 |
| 10388857 |
Spin torque MRAM fabrication using negative tone lithography and ion beam etching |
Anthony J. Annunziata, Armand A. Galan, Steve Holmes, Gen P. Lauer, Qinghuang Lin +1 more |
2019-08-20 |
$1,949,000 |
| 10276439 |
Rapid oxide etch for manufacturing through dielectric via structures |
Sebastian U. Engelmann, Li-Wen Hung, Eugene J. O'Sullivan, Jeff Waksman, Cornelia Tsang Yang |
2019-04-30 |
$3,198,000 |
| 10236252 |
Hybrid subtractive etch/metal fill process for fabricating interconnects |
Robert L. Bruce, Gregory M. Fritz, Hiroyuki Miyazoe |
2019-03-19 |
$3,213,000 |
| 10167443 |
Wet clean process for removing CxHyFz etch residue |
Robert L. Bruce, Sebastian U. Engelmann, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more |
2019-01-01 |
|
| 10170698 |
Spin torque MRAM fabrication using negative tone lithography and ion beam etching |
Anthony J. Annunziata, Armand A. Galan, Steve Holmes, Gen P. Lauer, Qinghuang Lin +1 more |
2019-01-01 |
|
| 10170361 |
Thin film interconnects with large grains |
Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Michael F. Lofaro, Hiroyuki Miyazoe +2 more |
2019-01-01 |
|
| 10128185 |
Hybrid subtractive etch/metal fill process for fabricating interconnects |
Robert L. Bruce, Gregory M. Fritz, Hiroyuki Miyazoe |
2018-11-13 |
$2,931,000 |
| 10121676 |
Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch |
Robert L. Bruce, Joe Lee, Takefumi Suzuki |
2018-11-06 |
$3,429,000 |
| 9934984 |
Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication |
Robert L. Bruce, Joe Lee, Takefumi Suzuki |
2018-04-03 |
$2,801,000 |
| 9911648 |
Interconnects based on subtractive etching of silver |
Brett C. Baker-O'Neal, Hiroyuki Miyazoe |
2018-03-06 |
$2,330,000 |
| 9799519 |
Selective sputtering with light mass ions to sharpen sidewall of subtractively patterned conductive metal layer |
Hiroyuki Miyazoe |
2017-10-24 |
$3,030,000 |
| 9799552 |
Low resistance metal contacts to interconnects |
Stephen M. Gates, Gregory M. Fritz, Terry A. Spooner |
2017-10-24 |
$3,030,000 |
| 9786597 |
Self-aligned pitch split for unidirectional metal wiring |
Josephine B. Chang, Michael A. Guillorn, Hiroyuki Miyazoe |
2017-10-10 |
$2,342,000 |
| 9786550 |
Low resistance metal contacts to interconnects |
Stephen M. Gates, Gregory M. Fritz, Terry A. Spooner |
2017-10-10 |
$2,342,000 |
| 9728421 |
High aspect ratio patterning of hard mask materials by organic soft masks |
Markus Brink, Sebastian U. Engelmann, Hiroyuki Miyazoe |
2017-08-08 |
$2,569,000 |
| 9711365 |
Etch rate enhancement for a silicon etch process through etch chamber pretreatment |
Goh Matsuura, Masahiro Nakamura, Edmund M. Sikorski, Bang N. To |
2017-07-18 |
$2,009,000 |
| 9705077 |
Spin torque MRAM fabrication using negative tone lithography and ion beam etching |
Anthony J. Annunziata, Armand A. Galan, Steve Holmes, Gen P. Lauer, Qinghuang Lin +1 more |
2017-07-11 |
$1,748,000 |
| 9691972 |
Low temperature encapsulation for magnetic tunnel junction |
Anthony J. Annunziata, Sebastian U. Engelmann, Gen P. Lauer, Nathan P. Marchack, Deborah A. Neumayer +1 more |
2017-06-27 |
$2,603,000 |
