Issued Patents All Time
Showing 25 most recent of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11220742 | Low temperature lift-off patterning for glassy carbon films | Steven J. Holmes, Stephen W. Bedell, Devendra K. Sadana, Damon B. Farmer, Nathan P. Marchack | 2022-01-11 |
| 11195145 | Blockchain ledgers of material spectral signatures for supply chain integrity management | Nicholas C. M. Fuller, Prabhakar Kudva | 2021-12-07 |
| 11168234 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Sampath Purushothaman, Mary E. Rothwell, Willi Volksen +1 more | 2021-11-09 |
| 10767084 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Sampath Purushothaman, Mary E. Rothwell, Willi Volksen +1 more | 2020-09-08 |
| 10727114 | Interconnect structure including airgaps and substractively etched metal lines | Robert L. Bruce, Alfred Grill, Eric A. Joseph, Teddie Peregrino Magbitang, Hiroyuki Miyazoe | 2020-07-28 |
| 10685323 | Blockchain ledgers of material spectral signatures for supply chain integrity management | Nicholas C. M. Fuller, Prabhakar Kudva | 2020-06-16 |
| 10684246 | On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling | Hariklia Deligianni, Bruce B. Doris, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin +2 more | 2020-06-16 |
| 10585060 | On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling | Hariklia Deligianni, Bruce B. Doris, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin +2 more | 2020-03-10 |
| 10541151 | Disposable laser/flash anneal absorber for embedded neuromorphic memory device fabrication | Kam-Leung Lee, Son V. Nguyen, Martin M. Frank, Vijay Narayanan | 2020-01-21 |
| 10467586 | Blockchain ledgers of material spectral signatures for supply chain integrity management | Nicholas C. M. Fuller, Prabhakar Kudva | 2019-11-05 |
| 10043923 | Laser doping of crystalline semiconductors using a dopant-containing amorphous silicon stack for dopant source and passivation | Katherine L. Saenger | 2018-08-07 |
| 9994741 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Sampath Purushothaman, Mary E. Rothwell, Willi Volksen +1 more | 2018-06-12 |
| 9984940 | Selective and conformal passivation layer for 3D high-mobility channel devices | Jack O. Chu, Stephen M. Gates, Masanobu Hatanaka, Vijay Narayanan, Yohei Ogawa +1 more | 2018-05-29 |
| 9881793 | Neutral hard mask and its application to graphoepitaxy-based directed self-assembly (DSA) patterning | Sebastian U. Engelmann, Mahmoud Khojasteh, John M. Papalia, HsinYu Tsai | 2018-01-30 |
| 9698339 | Magnetic tunnel junction encapsulation using hydrogenated amorphous semiconductor material | Anthony J. Annunziata, Marinus Hopstaken, Chandrasekara Kothandaraman, Junghyuk Lee, Jeong-Heon Park | 2017-07-04 |
| 9698043 | Shallow trench isolation for semiconductor devices | Kevin K. Chan, Stephan A. Cohen, Alfred Grill | 2017-07-04 |
| 9691972 | Low temperature encapsulation for magnetic tunnel junction | Anthony J. Annunziata, Sebastian U. Engelmann, Eric A. Joseph, Gen P. Lauer, Nathan P. Marchack +1 more | 2017-06-27 |
| 9679775 | Selective dopant junction for a group III-V semiconductor device | Kevin K. Chan, Marinus Hopstaken, Young-Hee Kim, Masaharu Kobayashi, Effendi Leobandung +3 more | 2017-06-13 |
| 9590054 | Low temperature spacer for advanced semiconductor devices | Kevin K. Chan, Alfred Grill, Dae-Gyu Park, Norma E. Sosa, Min Yang | 2017-03-07 |
| 9515252 | Low degradation MRAM encapsulation process using silicon-rich silicon nitride film | Anthony J. Annunziata, Chandrasekaran Kothandaraman, Gen P. Lauer, Junghyuk Lee, Nathan P. Marchack +2 more | 2016-12-06 |
| 9484403 | Boron rich nitride cap for total ionizing dose mitigation in SOI devices | Alfred Grill, Kenneth P. Rodbell | 2016-11-01 |
| 9484248 | Patternable dielectric film structure with improved lithography and method of fabricating same | Qinghuang Lin | 2016-11-01 |
| 9472450 | Graphene cap for copper interconnect structures | Griselda Bonilla, Christos D. Dimitrakopoulos, Alfred Grill, James B. Hannon, Qinghuang Lin +3 more | 2016-10-18 |
| 9418846 | Selective dopant junction for a group III-V semiconductor device | Kevin K. Chan, Marinus Hopstaken, Young-Hee Kim, Masaharu Kobayashi, Effendi Leobandung +3 more | 2016-08-16 |
| 9293557 | Low temperature spacer for advanced semiconductor devices | Kevin K. Chan, Alfred Grill, Dae-Gyu Park, Norma E. Sosa, Min Yang | 2016-03-22 |