Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11683995 | Lithography for fabricating Josephson junctions | Kenneth P. Rodbell, Leonidas E. Ocola, Charles Thomas Rettner, Elbert E. Huang | 2023-06-20 |
| 11168234 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Willi Volksen +1 more | 2021-11-09 |
| 10767084 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Willi Volksen +1 more | 2020-09-08 |
| 10008655 | Suspended superconducting qubits | Josephine B. Chang, George A. Keefe, Chad Tyler Rigetti | 2018-06-26 |
| 9994741 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Willi Volksen +1 more | 2018-06-12 |
| 9716219 | Suspended superconducting qubits | Josephine B. Chang, George A. Keefe, Chad Tyler Rigetti | 2017-07-25 |
| 9531055 | Removal of spurious microwave modes via flip-chip crossover | David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, James R. Rozen +1 more | 2016-12-27 |
| 9520547 | Chip mode isolation and cross-talk reduction through buried metal layers and through-vias | David W. Abraham, George A. Keefe, Christian Lavoie | 2016-12-13 |
| 9455392 | Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossover | David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, James R. Rozen +1 more | 2016-09-27 |
| 9397283 | Chip mode isolation and cross-talk reduction through buried metal layers and through-vias | David W. Abraham, George A. Keefe, Christian Lavoie | 2016-07-19 |
| 9219298 | Removal of spurious microwave modes via flip-chip crossover | David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, James R. Rozen +1 more | 2015-12-22 |
| 9177814 | Suspended superconducting qubits | Josephine B. Chang, George A. Keefe, Chad Tyler Rigetti | 2015-11-03 |
| 9064717 | Lock and key through-via method for wafer level 3D integration and structures produced thereby | Sampath Purushothaman, Ghavam G. Shahidi, Roy R. Yu | 2015-06-23 |
| 8954125 | Low-loss superconducting devices | Antonio D. Corcoles Gonzalez, Jiansong Gao, Dustin A. Hite, George A. Keefe, David Pappas +4 more | 2015-02-10 |
| 8093099 | Lock and key through-via method for wafer level 3D integration and structures produced | Sampath Purushothaman, Ghavam G. Shahidi, Roy R. Yu | 2012-01-10 |
| 7855455 | Lock and key through-via method for wafer level 3 D integration and structures produced | Sampath Purushothaman, Ghavam G. Shahidi, Roy R. Yu | 2010-12-21 |
| 6890599 | Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays | Stephen L. Buchwalter, Gareth G. Hougham, Kang-Wook Lee, John J. Ritsko, Peter M. Fryer | 2005-05-10 |
| 6632536 | Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays | Stephen L. Buchwalter, Gareth G. Hougham, Kang-Wook Lee, John J. Ritsko, Peter M. Fryer | 2003-10-14 |
| 6380101 | Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereof | Tricia Breen, Peter M. Fryer, Ronald W. Nunes | 2002-04-30 |