| 11683995 |
Lithography for fabricating Josephson junctions |
Kenneth P. Rodbell, Leonidas E. Ocola, Charles Thomas Rettner, Elbert E. Huang |
2023-06-20 |
| 11168234 |
Enhanced adhesive materials and processes for 3D applications |
James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Willi Volksen +1 more |
2021-11-09 |
| 10767084 |
Enhanced adhesive materials and processes for 3D applications |
James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Willi Volksen +1 more |
2020-09-08 |
| 10008655 |
Suspended superconducting qubits |
Josephine B. Chang, George A. Keefe, Chad Tyler Rigetti |
2018-06-26 |
| 9994741 |
Enhanced adhesive materials and processes for 3D applications |
James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Willi Volksen +1 more |
2018-06-12 |
| 9716219 |
Suspended superconducting qubits |
Josephine B. Chang, George A. Keefe, Chad Tyler Rigetti |
2017-07-25 |
| 9531055 |
Removal of spurious microwave modes via flip-chip crossover |
David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, James R. Rozen +1 more |
2016-12-27 |
| 9520547 |
Chip mode isolation and cross-talk reduction through buried metal layers and through-vias |
David W. Abraham, George A. Keefe, Christian Lavoie |
2016-12-13 |
| 9455392 |
Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossover |
David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, James R. Rozen +1 more |
2016-09-27 |
| 9397283 |
Chip mode isolation and cross-talk reduction through buried metal layers and through-vias |
David W. Abraham, George A. Keefe, Christian Lavoie |
2016-07-19 |
| 9219298 |
Removal of spurious microwave modes via flip-chip crossover |
David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, James R. Rozen +1 more |
2015-12-22 |
| 9177814 |
Suspended superconducting qubits |
Josephine B. Chang, George A. Keefe, Chad Tyler Rigetti |
2015-11-03 |
| 9064717 |
Lock and key through-via method for wafer level 3D integration and structures produced thereby |
Sampath Purushothaman, Ghavam G. Shahidi, Roy R. Yu |
2015-06-23 |
| 8954125 |
Low-loss superconducting devices |
Antonio D. Corcoles Gonzalez, Jiansong Gao, Dustin A. Hite, George A. Keefe, David Pappas +4 more |
2015-02-10 |
| 8093099 |
Lock and key through-via method for wafer level 3D integration and structures produced |
Sampath Purushothaman, Ghavam G. Shahidi, Roy R. Yu |
2012-01-10 |
| 7855455 |
Lock and key through-via method for wafer level 3 D integration and structures produced |
Sampath Purushothaman, Ghavam G. Shahidi, Roy R. Yu |
2010-12-21 |
| 6890599 |
Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays |
Stephen L. Buchwalter, Gareth G. Hougham, Kang-Wook Lee, John J. Ritsko, Peter M. Fryer |
2005-05-10 |
| 6632536 |
Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays |
Stephen L. Buchwalter, Gareth G. Hougham, Kang-Wook Lee, John J. Ritsko, Peter M. Fryer |
2003-10-14 |
| 6380101 |
Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereof |
Tricia Breen, Peter M. Fryer, Ronald W. Nunes |
2002-04-30 |
