JR

John J. Ritsko

IBM: 20 patents #5,451 of 70,183Top 8%
IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #196,749 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10424101 System and method for enabling multiple-state avatars Vittorio Castelli, Rick A. Hamilton, II, Clifford A. Pickover 2019-09-24
9324173 System and method for enabling multiple-state avatars Vittorio Castelli, Rick A. Hamilton, II, Clifford A. Pickover 2016-04-26
6890599 Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays Stephen L. Buchwalter, Gareth G. Hougham, Kang-Wook Lee, Mary E. Rothwell, Peter M. Fryer 2005-05-10
6682786 Liquid crystal display cell having liquid crystal molecules in vertical or substantially vertical alignment Shui-Chih Lien, Alessandro C. Callegari, Paul S. Andry, Praveen Chaudhari, James A. Lacey +6 more 2004-01-27
6632536 Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays Stephen L. Buchwalter, Gareth G. Hougham, Kang-Wook Lee, Mary E. Rothwell, Peter M. Fryer 2003-10-14
6583847 Self alignment of substrates by magnetic alignment Alessandro C. Callegari, Praveen Chaudhari, James P. Doyle, Eileen A. Galligan, James A. Lacey +3 more 2003-06-24
6177975 Precision alignment of plates Stephen L. Buchwalter, David Lewis, Shui-Chih Lien, Sampath Purushothaman 2001-01-23
6104466 Precision alignment of plates Stephen L. Buchwalter, David Lewis, Shui-Chih Lien, Sampath Purushothaman 2000-08-15
5599582 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more 1997-02-04
5582858 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more 1996-12-10
5531022 Method of forming a three dimensional high performance interconnection package Brain S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more 1996-07-02
5371654 Three dimensional high performance interconnection package Brian S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more 1994-12-06
5326643 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more 1994-07-05
5296189 Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith Sung Kwon Kang, Sampath Purushothaman, Jane M. Shaw, Subhash L. Shinde 1994-03-22
5185073 Method of fabricating nendritic materials Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more 1993-02-09
5170245 Semiconductor device having metallic interconnects formed by grit blasting Jungihl Kim, Joseph C. Logue, Robert R. Shaw, George F. Walker 1992-12-08
5137461 Separable electrical connection technology Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more 1992-08-11
4933635 In-line process monitors for thin film wiring Alina Deutsch, Modest M. Oprysko, Laura Rothman, Helen L. Yeh, Atilio Zupicich 1990-06-12
4923772 High energy laser mask and method of making same Steven J. Kirch, John R. Lankard, Sr., Kurt A. Smith, James L. Speidell, James T. Yeh 1990-05-08
4896464 Formation of metallic interconnects by grit blasting Jungihl Kim, Joseph C. Logue, Robert R. Shaw, George F. Walker 1990-01-30
4846929 Wet etching of thermally or chemically cured polyimide Steven L. Bard, Claudius Feger, John J. Glenning, Gareth G. Hougham, Steven E. Molis +3 more 1989-07-11
4622095 Laser stimulated halogen gas etching of metal substrates Warren D. Grobman, Fahfu Ho, Jerry E. Hurst, Jr., Yaffa Tomkiewicz 1986-11-11