Issued Patents All Time
Showing 25 most recent of 128 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961958 | 3D textured composite silicon anode and fluorinated lithium compound electrochemical cell | John Collins, Bucknell C. Webb, Teodor K. Todorov, Devendra K. Sadana | 2024-04-16 |
| 11824037 | Assembly of a chip to a substrate | Katsuyuki Sakuma, Mukta G. Farooq, Russell Kastberg | 2023-11-21 |
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more | 2023-10-17 |
| 11587896 | Transferrable pillar structure for fanout package or interconnect bridge | Joshua M. Rubin, Yang Liu, Steven L. Wright | 2023-02-21 |
| 11489219 | Encapsulating in-situ energy storage device with electrode contact | John Collins, Devendra K. Sadana, Bucknell C. Webb | 2022-11-01 |
| 11424152 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2022-08-23 |
| 11411272 | Simplified hermetic packaging of a micro-battery | Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-08-09 |
| 11362382 | Simplified hermetic packaging of a micro-battery | Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-06-14 |
| 11316164 | Microbattery with through-silicon via electrodes | Bucknell C. Webb | 2022-04-26 |
| 11288587 | Modular, frequency-flexible, superconducting quantum processor architecture | Hanhee Paik, Jae-Woong Nah, Martin O. Sandberg | 2022-03-29 |
| 11258132 | Microbattery separator | Eric P. Lewandowski, Adam Toner, Daniel B. Otts, James Daniel Riall, Cornelia Tsang Yang | 2022-02-22 |
| 11183725 | Low-profile battery construct with engineered interfaces | Paul A. Lauro, Jae-Woong Nah, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2021-11-23 |
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Kamal K. Sikka, Yang Liu, Pascale Gagnon, Christian Bergeron, Maryse Cournoyer | 2021-10-05 |
| 11127715 | Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same | Mark D. Schultz, Cornelia K. Tsang | 2021-09-21 |
| 11121005 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2021-09-14 |
| 11043690 | Sandwich-parallel micro-battery | Jae-Woong Nah, Eric P. Lewandowski, Bucknell C. Webb, Adinath S. Narasgond, Bo Wen | 2021-06-22 |
| 10687425 | Method of forming a plurality of electro-optical module assemblies | Qianwen Chen, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-06-16 |
| 10686164 | Cathode for thin film microbattery | Eric P. Lewandowski, Yu Luo, Adinath S. Narasgond | 2020-06-16 |
| 10679887 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-06-09 |
| 10670656 | Integrated electro-optical module assembly | Qianwen Chen, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-06-02 |
| 10638613 | Method of forming a plurality of electro-optical module assemblies | Qianwen Chen, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-04-28 |
| 10622590 | Method of forming a homogeneous solid metallic anode for a thin film microbattery | Gregory M. Fritz, Michael S. Gordon, Eric P. Lewandowski, Yu Luo | 2020-04-14 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-03-10 |
| 10581037 | Low-profile battery construct with engineered interfaces | Paul A. Lauro, Jae-Woong Nah, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2020-03-03 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-02-25 |