Issued Patents All Time
Showing 26–50 of 128 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431828 | Microbattery with through-silicon via electrodes | Bucknell C. Webb | 2019-10-01 |
| 10393798 | Integrated electro-optical module assembly | Qianwen Chen, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2019-08-27 |
| 10388929 | Microbattery separator | Eric P. Lewandowski, Adam Toner, Daniel B. Otts, James Daniel Riall, Cornelia Tsang Yang | 2019-08-20 |
| 10381255 | Double layer release temporary bond and debond processes and systems | Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2019-08-13 |
| 10347588 | Thin 3D die with electromagnetic radiation blocking encapsulation | Cornelia K. Tsang, Adam Toner | 2019-07-09 |
| 10325785 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-06-18 |
| 10297876 | Micro battery design and diagnosis | Qiang Huang, Yu Luo, Adinath S. Narasgond | 2019-05-21 |
| 10280077 | Flexible electronics for wearable healthcare sensors | Huan Hu, Katsuyuki Sakuma | 2019-05-07 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2019-03-05 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-03-05 |
| 10177116 | Large channel interconnects with through silicon vias (TSVs) and method for constructing the same | Mark D. Schultz, Cornelia K. Tsang | 2019-01-08 |
| 10166632 | In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method | Russell A. Budd, Robert J. Polastre | 2019-01-01 |
| 10162013 | Micro battery design and diagnosis | Qiang Huang, Yu Luo, Adinath S. Narasgond | 2018-12-25 |
| 10118250 | In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method | Russell A. Budd, Robert J. Polastre | 2018-11-06 |
| 10096802 | Homogeneous solid metallic anode for thin film microbattery | Gregory M. Fritz, Michael S. Gordon, Eric P. Lewandowski, Yu Luo | 2018-10-09 |
| 10079375 | Dual seal microbattery and method of making | Joana Sofia Branquinho Teresa Maria, Jeffrey D. Gelorme, Jae-Woong Nah, Adinath S. Narasgond, Bucknell C. Webb | 2018-09-18 |
| 10069116 | Cathode for thin film microbattery | Eric P. Lewandowski, Yu Luo, Adinath S. Narasgond | 2018-09-04 |
| 10056337 | Thin 3D die with electromagnetic radiation blocking encapsulation | Cornelia K. Tsang, Adam Toner | 2018-08-21 |
| 9953501 | Methods of forming microelectronic smart tags | Monty M. Denneau, John U. Knickerbocker, Robert L. Wisnieff | 2018-04-24 |
| 9947570 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2018-04-17 |
| 9941788 | Three-D power converter in three distinct strata | Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff | 2018-04-10 |
| 9876200 | All-silicon hermetic package and processing for narrow, low-profile microbatteries | Bucknell C. Webb, Cornelia Tsang Yang | 2018-01-23 |
| 9822002 | Flexible electronics for wearable healthcare sensors | Huan Hu, Katsuyuki Sakuma | 2017-11-21 |
| 9806299 | Cathode for thin film microbattery | Eric P. Lewandowski, Yu Luo, Adinath S. Narasgond | 2017-10-31 |
| 9748131 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2017-08-29 |