MS

Mark D. Schultz

IBM: 117 patents #431 of 70,183Top 1%
HG HGST: 12 patents #129 of 1,677Top 8%
CG Cummins Power Generation: 1 patents #140 of 278Top 55%
GM Graco Minnesota: 1 patents #239 of 381Top 65%
HB Hitachi Global Technologies Netherlands B.V.: 1 patents #2 of 42Top 5%
Overall (All Time): #8,158 of 4,157,543Top 1%
132
Patents All Time

Issued Patents All Time

Showing 25 most recent of 132 patents

Patent #TitleCo-InventorsDate
12158314 Reduced pressure drop cold plate transition 2024-12-03
12028997 Rotating lid for module cooler Noah Singer, Jeffrey A. Zitz, John G. Torok, William L. Brodsky, Yuet-Ying Yu +1 more 2024-07-02
12004322 Cold plate with uniform plenum flow Pritish R. Parida 2024-06-04
11923269 Co-packaged optical module Fuad E. Doany, Benjamin G. Lee, Daniel M. Kuchta, Christian Wilhelmus Baks 2024-03-05
11800666 Temporary removable module lid Noah Singer, Jeffrey A. Zitz, John G. Torok, Yuet-Ying Yu, William L. Brodsky +1 more 2023-10-24
11737248 Data center coolant switch Madhusudan K. Iyengar, Pritish R. Parida 2023-08-22
11698233 Reduced pressure drop cold plate transition 2023-07-11
11515230 Variable pin fin construction to facilitate compliant cold plates 2022-11-29
11508643 Thermal interface formed by condensate John P. Karidis 2022-11-22
11497143 Mechanically flexible cold plates for low power components Paul W. Coteus, Todd E. Takken, Shurong Tian 2022-11-08
11300112 Pump drive system Thomas F. Janecek, Tyler K. Williams, Andrew J. Kopel, Jarrod C. Drexler, Douglas S. Ryder 2022-04-12
11278978 Pattern bonded finned cold plate 2022-03-22
11277944 Energy efficiency based control for a cooling system Timothy J. Chainer, Pritish R. Parida 2022-03-15
11201102 Module lid with embedded two-phase cooling and insulating layer Pritish R. Parida, Timothy J. Chainer 2021-12-14
11158565 Compliant pin fin heat sink and methods John P. Karidis 2021-10-26
11131506 Burst resistant thin wall heat sink Paul W. Coteus, Shawn A. Hall, Todd E. Takken, Shurong Tian 2021-09-28
11127715 Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same Paul S. Andry, Cornelia K. Tsang 2021-09-21
11009926 System level model for pumped two-phase cooling systems Timothy J. Chainer, Leitao Chen, Pritish R. Parida, Fanghao Yang 2021-05-18
11013152 Data center coolant switch Madhusudan K. Iyengar, Pritish R. Parida 2021-05-18
10991639 Compliant Pin Fin heat sink with base integral pins 2021-04-27
10937671 Conductive heat spreader and heat sink assembly for optical devices Fuad E. Doany 2021-03-02
10749817 High-density, fail-in-place switches for computer and data networks Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Todd E. Takken, Shurong Tian 2020-08-18
10727158 Counter-flow expanding channels for enhanced two-phase heat removal Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more 2020-07-28
10727159 Counter-flow expanding channels for enhanced two-phase heat removal Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more 2020-07-28
10701832 Two-phase liquid cooled electronics Timothy J. Chainer, Pritish R. Parida 2020-06-30