Issued Patents All Time
Showing 26–50 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10653044 | Energy efficiency based control for a cooling system | Timothy J. Chainer, Pritish R. Parida | 2020-05-12 |
| 10631438 | Mechanically flexible cold plates for low power components | Paul W. Coteus, Todd E. Takken, Shurong Tian | 2020-04-21 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Jeffrey D. Gelorme +4 more | 2020-03-31 |
| 10585462 | System level model for pumped two-phase cooling systems | Timothy J. Chainer, Leitao Chen, Pritish R. Parida, Fanghao Yang | 2020-03-10 |
| 10529648 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2020-01-07 |
| 10504814 | Variable pin fin construction to facilitate compliant cold plates | — | 2019-12-10 |
| 10499543 | Two-phase liquid cooled electronics | Timothy J. Chainer, Pritish R. Parida | 2019-12-03 |
| 10440862 | Data center coolant switch | Madhusudan K. Iyengar, Pritish R. Parida | 2019-10-08 |
| 10389654 | High-density, fail-in-place switches for computer and data networks | Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Todd E. Takken, Shurong Tian | 2019-08-20 |
| 10342165 | Data center coolant switch | Madhusudan K. Iyengar, Pritish R. Parida | 2019-07-02 |
| 10269592 | Conductive heat spreader and heat sink assembly for optical devices | Fuad E. Doany | 2019-04-23 |
| 10244655 | Two-phase liquid cooled electronics | Timothy J. Chainer, Pritish R. Parida | 2019-03-26 |
| 10231356 | Cold plate | Christopher M. Marroquin, Kevin M. O'Connell, Shurong Tian | 2019-03-12 |
| 10222125 | Burst resistant thin wall heat sink | Paul W. Coteus, Shawn A. Hall, Todd E. Takken, Shurong Tian | 2019-03-05 |
| 10215504 | Flexible cold plate with enhanced flexibility | Paul W. Coteus, Shawn A. Hall, Todd E. Takken, Shurong Tian | 2019-02-26 |
| 10177116 | Large channel interconnects with through silicon vias (TSVs) and method for constructing the same | Paul S. Andry, Cornelia K. Tsang | 2019-01-08 |
| 10170392 | Wafer level integration for embedded cooling | Timothy J. Chainer, Pritish R. Parida | 2019-01-01 |
| 10168108 | Pin fin compliant heat sink with enhanced flexibility | — | 2019-01-01 |
| 10143109 | Passive two-phase cooling with forced cooling assist | Timothy J. Chainer, Pritish R. Parida | 2018-11-27 |
| 10136554 | Passive two-phase cooling with forced cooling assist | Timothy J. Chainer, Pritish R. Parida | 2018-11-20 |
| 9997435 | Compliant pin fin heat sink and methods | John P. Karidis | 2018-06-12 |
| 9941189 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2018-04-10 |
| 9939210 | Pin fin compliant heat sink with enhanced flexibility | — | 2018-04-10 |
| 9922900 | Near-chip compliant layer for reducing perimeter stress during assembly process | Todd E. Takken, Shurong Tian, Yuan Yao | 2018-03-20 |
| 9894801 | Cold plate | Christopher M. Marroquin, Kevin M. O'Connell, Shurong Tian | 2018-02-13 |