Issued Patents All Time
Showing 25 most recent of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12382581 | Sidewall plating of circuit boards for layer transition connections | Yuan Yao | 2025-08-05 |
| 12300577 | Heterogeneous integrated multi-chip cooler module | Timothy J. Chainer, Joshua M. Rubin, Arvind Kumar | 2025-05-13 |
| 12262514 | Heat sinks with beyond-board fins | Shurong Tian, Joshua M. Rubin | 2025-03-25 |
| 12230436 | Spacer to reduce magnetic coupling | Yuan Yao, Xin Zhang, Andrew Ferencz, Shurong Tian | 2025-02-18 |
| 12183999 | Separable interface cable structure for high voltage under-module power input | Xin Zhang, Yuan Yao, Andrew Ferencz | 2024-12-31 |
| 11817250 | Broadside coupled coplanar inductors | Xin Zhang | 2023-11-14 |
| 11799384 | Power converter with co-packaged secondary field effect transistors (FETs) | Xin Zhang, Andrew Ferencz | 2023-10-24 |
| 11799374 | Vertical power delivery packaging structure | Xin Zhang, Yuan Yao | 2023-10-24 |
| 11792911 | Flexible cold plate for contacting varied and variable chip heights | Shurong Tian | 2023-10-17 |
| 11792954 | Dedicated airflow channels for cooling server drawers | Shurong Tian | 2023-10-17 |
| 11765849 | Daughter card plug detection | Stanley Eckert, Steven Louis Makow | 2023-09-19 |
| 11687148 | Stacked, reconfigurable co-regulation of processing units for ultra-wide DVFS | Robert K. Montoye, Kevin Tien, Yutaka Nakamura, Jeffrey H. Derby, Martin Cochet +1 more | 2023-06-27 |
| 11631635 | Flex prevention mechanical structure such as a ring for large integrated circuit modules and packages and methods of manufacture using same | Shurong Tian | 2023-04-18 |
| 11621212 | Backing plate with manufactured features on top surface | Yuan Yao, Shurong Tian | 2023-04-04 |
| 11532421 | Magnetic cores with high reluctance differences in flux paths | Yuan Yao, Andrew Ferencz, Xin Zhang, Liam Daley McAuliffe | 2022-12-20 |
| 11497143 | Mechanically flexible cold plates for low power components | Paul W. Coteus, Mark D. Schultz, Shurong Tian | 2022-11-08 |
| 11439043 | Multi-device cooling structure having assembly alignment features | Shurong Tian, Liam Daley McAuliffe | 2022-09-06 |
| 11367557 | Semiconductor chip having one or more on-chip metal winding and enclosed by top and bottom chip-external ferromagnetic cores | Xin Zhang | 2022-06-21 |
| 11362109 | Integrated power amplifier | Ko-Tao Lee, Xin Zhang | 2022-06-14 |
| 11350544 | Flexible cold plate with parallel fluid flow paths | Shurong Tian | 2022-05-31 |
| 11243034 | Injection-molded flexible cold plate | Shurong Tian | 2022-02-08 |
| 11150712 | Smart controller with phantom inductor current sensing for switched mode power supplies | Xin Zhang, Andrew Ferencz, Leland Chang, Paul W. Coteus | 2021-10-19 |
| 11131506 | Burst resistant thin wall heat sink | Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Shurong Tian | 2021-09-28 |
| 11114944 | Fully integrated multi-phase buck converter with coupled air core inductors | Xin Zhang, Naigang Wang, Leland Chang | 2021-09-07 |
| 11058030 | Cold plate with flex regions between fin areas | Shurong Tian | 2021-07-06 |