| 12382581 |
Sidewall plating of circuit boards for layer transition connections |
Yuan Yao |
2025-08-05 |
|
| 12300577 |
Heterogeneous integrated multi-chip cooler module |
Timothy J. Chainer, Joshua M. Rubin, Arvind Kumar |
2025-05-13 |
|
| 12262514 |
Heat sinks with beyond-board fins |
Shurong Tian, Joshua M. Rubin |
2025-03-25 |
|
| 12230436 |
Spacer to reduce magnetic coupling |
Yuan Yao, Xin Zhang, Andrew Ferencz, Shurong Tian |
2025-02-18 |
|
| 12183999 |
Separable interface cable structure for high voltage under-module power input |
Xin Zhang, Yuan Yao, Andrew Ferencz |
2024-12-31 |
$22,533,000 |
| 11817250 |
Broadside coupled coplanar inductors |
Xin Zhang |
2023-11-14 |
$8,271,000 |
| 11799384 |
Power converter with co-packaged secondary field effect transistors (FETs) |
Xin Zhang, Andrew Ferencz |
2023-10-24 |
$9,282,000 |
| 11799374 |
Vertical power delivery packaging structure |
Xin Zhang, Yuan Yao |
2023-10-24 |
$9,282,000 |
| 11792954 |
Dedicated airflow channels for cooling server drawers |
Shurong Tian |
2023-10-17 |
$7,011,000 |
| 11792911 |
Flexible cold plate for contacting varied and variable chip heights |
Shurong Tian |
2023-10-17 |
$7,011,000 |
| 11765849 |
Daughter card plug detection |
Stanley Eckert, Steven Louis Makow |
2023-09-19 |
|
| 11687148 |
Stacked, reconfigurable co-regulation of processing units for ultra-wide DVFS |
Robert K. Montoye, Kevin Tien, Yutaka Nakamura, Jeffrey H. Derby, Martin Cochet +1 more |
2023-06-27 |
$4,778,000 |
| 11631635 |
Flex prevention mechanical structure such as a ring for large integrated circuit modules and packages and methods of manufacture using same |
Shurong Tian |
2023-04-18 |
$12,037,000 |
| 11621212 |
Backing plate with manufactured features on top surface |
Yuan Yao, Shurong Tian |
2023-04-04 |
$5,091,000 |
| 11532421 |
Magnetic cores with high reluctance differences in flux paths |
Yuan Yao, Andrew Ferencz, Xin Zhang, Liam Daley McAuliffe |
2022-12-20 |
$17,447,000 |
| 11497143 |
Mechanically flexible cold plates for low power components |
Paul W. Coteus, Mark D. Schultz, Shurong Tian |
2022-11-08 |
$10,347,000 |
| 11439043 |
Multi-device cooling structure having assembly alignment features |
Shurong Tian, Liam Daley McAuliffe |
2022-09-06 |
$10,660,000 |
| 11367557 |
Semiconductor chip having one or more on-chip metal winding and enclosed by top and bottom chip-external ferromagnetic cores |
Xin Zhang |
2022-06-21 |
$14,046,000 |
| 11362109 |
Integrated power amplifier |
Ko-Tao Lee, Xin Zhang |
2022-06-14 |
$8,092,000 |
| 11350544 |
Flexible cold plate with parallel fluid flow paths |
Shurong Tian |
2022-05-31 |
$8,769,000 |
| 11243034 |
Injection-molded flexible cold plate |
Shurong Tian |
2022-02-08 |
$4,353,000 |
| 11150712 |
Smart controller with phantom inductor current sensing for switched mode power supplies |
Xin Zhang, Andrew Ferencz, Leland Chang, Paul W. Coteus |
2021-10-19 |
$2,168,000 |
| 11131506 |
Burst resistant thin wall heat sink |
Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Shurong Tian |
2021-09-28 |
$6,479,000 |
| 11114944 |
Fully integrated multi-phase buck converter with coupled air core inductors |
Xin Zhang, Naigang Wang, Leland Chang |
2021-09-07 |
$7,685,000 |
| 11056413 |
Combined inductor and heat transfer device |
Xin Zhang, Shurong Tian, Yuan Yao |
2021-07-06 |
$5,313,000 |
