Issued Patents All Time
Showing 25 most recent of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967548 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2024-04-23 |
| 11880755 | Semi-supervised learning with group constraints | Patrick Lustenberger, Andrea Giovannini, Adam Ivankay | 2024-01-23 |
| 11251160 | Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Gerd Schlottig | 2022-02-15 |
| 11235404 | Personalized copper block for selective solder removal | Charles L. Arvin, Luca Del Carro, Thomas Weiss, Chris Muzzy | 2022-02-01 |
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Charles L. Arvin, Kevin Drummond, Luca Del Carro, Stephanie Allard, Kenneth C. Marston +1 more | 2021-11-02 |
| 11158450 | Particle-based, anisotropic composite materials for magnetic cores | Arvind Raj Mahankali Sridhar, Suiying Ye, Luca Del Carro, Jens Oliver Ammann | 2021-10-26 |
| 11096290 | Printed circuit board with edge soldering for high-density packages and assemblies | Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Joerg-Eric Sagmeister, Patricia M. Sagmeister +1 more | 2021-08-17 |
| 10886254 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Gerd Schlottig | 2021-01-05 |
| 10882145 | Adsorption heat exchanger devices | Javier V. Goicochea, Bruno Michel, Patrick Ruch | 2021-01-05 |
| 10833049 | Method for electrical coupling and electric coupling arrangement | Richard D. Dixon, Maaike M. Visser Taklo, Bernhard Wunderle, Kerry Yu, Jonas Zuercher | 2020-11-10 |
| 10777496 | Chip packages with sintered interconnects formed out of pads | Luca Del Carro, Jonas Zürcher | 2020-09-15 |
| 10767939 | Disconnect assembly for active cooling of packaged electronics | Gerd Schlottig, Stephan Paredes, Ingmar G. Meijer | 2020-09-08 |
| 10727159 | Counter-flow expanding channels for enhanced two-phase heat removal | Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-07-28 |
| 10727158 | Counter-flow expanding channels for enhanced two-phase heat removal | Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-07-28 |
| 10622295 | Circuitized substrate with electronic components mounted on transversal portion thereof | Sebastian Gerke, Stefano S. Oggioni | 2020-04-14 |
| 10622294 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2020-04-14 |
| 10622296 | Circuitized substrate with electronic components mounted on transversal portion thereof | Sebastian Gerke, Stefano S. Oggioni | 2020-04-14 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Jeffrey D. Gelorme, Gerard McVicker +4 more | 2020-03-31 |
| 10586760 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2020-03-10 |
| 10529648 | Counter-flow expanding channels for enhanced two-phase heat removal | Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-01-07 |
| 10527365 | Disconnect assembly for active cooling of packaged electronics | Gerd Schlottig, Stephan Paredes, Ingmar G. Meijer | 2020-01-07 |
| 10388540 | High-performance compliant heat-exchanger comprising vapor chamber | Ingmar G. Meijer, Stephan Paredes, Gerd Schlottig | 2019-08-20 |
| 10278306 | Method and device for cooling a heat generating component | Urs Kloter, Ryan J. Linderman, Bruno Michel, Hugo E. Rothuizen, Reto Waelchli | 2019-04-30 |
| 10170445 | Method for electrical coupling and electric coupling arrangement | Richard D. Dixon, Maaike M. Visser Taklo, Bernhard Wunderle, Kerry Yu, Jonas Zuercher | 2019-01-01 |
| 10153250 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Gerd Schlottig | 2018-12-11 |