Ryan J. Linderman — 12 Patents at IBM

Ryan J. Linderman has been granted 12 US patents while listed as an inventor at IBM. The first was granted in 2009 and the most recent in April 2019. Ryan J. Linderman ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Ryan J. Linderman in Pasadena, CA, US.

Patents per Year

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Showing 1–12 of 12 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10278306	Method and device for cooling a heat generating component	Thomas J. Brunschwiler, Urs Kloter, Bruno Michel, Hugo E. Rothuizen, Reto Waelchli	2019-04-30	$28,269,000
10091909	Method and device for cooling a heat generating component	Thomas J. Brunschwiler, Urs Kloter, Bruno Michel, Hugo E. Rothuizen, Reio Waelchli	2018-10-02	$17,112,000
9054074	One-dimensional hierarchical nested channel design for continuous feed manufacturing processes	Thomas J. Brunschwiler, Erich M. Ruetsche	2015-06-09	$3,292,000
8659898	Integrated circuit stack	Thomas J. Brunschwiler, Bruno Michel, Hugo E. Rothuizen	2014-02-25	$6,334,000
8363402	Integrated circuit stack	Thomas J. Brunschwiler, Bruno Michel, Hugo E. Rothuizen	2013-01-29	$3,874,000
8107234	Variable flow computer cooling system for a data center and method of operation	Thomas J. Brunschwiler, Bruno Michel, Erich M. Ruetsche	2012-01-31	$4,013,000
8004832	Variable flow computer cooling system for a data center and method of operation	Thomas J. Brunschwiler, Bruno Michel, Erich M. Ruetsche	2011-08-23	$4,386,000
7872867	Cooling system for an electronic component system cabinet	Thomas J. Brunschwiler, Hugo E. Rothuizen, Reto Waelchli	2011-01-18	$5,934,000
7866173	Variable performance server system and method of operation	Thomas J. Brunschwiler, Bruno Michel, Erich M. Ruetsche	2011-01-11	$2,856,000
7808780	Variable flow computer cooling system for a data center and method of operation	Thomas J. Brunschwiler, Bruno Michel, Erich M. Ruetsche	2010-10-05	$4,341,000
7547582	Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies	Thomas J. Brunschwiler, Bruno Michel, Urs Kloter, Hugo E. Rothuizen	2009-06-16	$12,733,000
7532475	Semiconductor chip assembly with flexible metal cantilevers	Bruno Michel, Thomas J. Brunschwiler, Hugo E. Rothuizen, Urs Kloter	2009-05-12	$9,410,000

Ryan J. Linderman — 12 Patents

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