Issued Patents All Time
Showing 25 most recent of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11224927 | Circuit card attachment for enhanced robustness of thermal performance | Edward J. Yarmchuk | 2022-01-18 |
| 11140786 | Thermal interface adhesion for transfer molded electronic components | Timothy J. Chainer | 2021-10-05 |
| 10908110 | Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures | Timothy J. Chainer, Edward J. Yarmchuk | 2021-02-02 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Jeffrey D. Gelorme, Gerard McVicker +4 more | 2020-03-31 |
| 10548228 | Thermal interface adhesion for transfer molded electronic components | Timothy J. Chainer | 2020-01-28 |
| 10338024 | Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures | Timothy J. Chainer, Edward J. Yarmchuk | 2019-07-02 |
| 10249516 | Underfill dispensing using funnels | Evan G. Colgan, Katsuyuki Sakuma, Donald A. Merte | 2019-04-02 |
| 10194522 | Thermal interface solution with reduced adhesion force | Timothy J. Chainer | 2019-01-29 |
| 10168436 | Water soluble low alpha particle emission electrically-conductive coating | Jeffrey D. Gelorme, Michael S. Gordon | 2019-01-01 |
| 10147694 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Paul A. Lauro, Jae-Woong Nah | 2018-12-04 |
| 10141236 | Flip chip ball grid array with low impedence and grounded lid | Martin Beaumier, Yves Dallaire, Melania C. Doll, Edward J. Yarmchuk | 2018-11-27 |
| 10043725 | Flip chip ball grid array with low impedence and grounded lid | Martin Beaumier, Yves Dallaire, Melania C. Doll, Edward J. Yarmchuk | 2018-08-07 |
| 9852960 | Underfill dispensing using funnels | Evan G. Colgan, Katsuyuki Sakuma, Donald A. Merte | 2017-12-26 |
| 9686853 | Thermal interface solution with reduced adhesion force | Timothy J. Chainer | 2017-06-20 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, John U. Knickerbocker, Eric P. Lewandowski +2 more | 2016-10-18 |
| 9343423 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Jae-Woong Nah, Da-Yuan Shih | 2016-05-17 |
| 9321245 | Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion | Eric P. Lewandowski, Jae-Woong Nah, Robert J. Polastre | 2016-04-26 |
| 9305896 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Jae-Woong Nah, Da-Yuan Shih | 2016-04-05 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Paul A. Lauro, Jae-Woong Nah | 2016-03-01 |
| 9272498 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Kenneth C. Marston, Steven P. Ostrander | 2016-03-01 |
| 9181440 | Low alpha particle emission electrically-conductive coating | Michael S. Gordon, Eric P. Lewandowski | 2015-11-10 |
| 9153460 | Heatsink attachment module | Evan G. Colgan, Jeffrey A. Zitz | 2015-10-06 |
| 9042120 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Pascale Gagnon, Eric Giguere, Eric Salvas +1 more | 2015-05-26 |
| 8963340 | No flow underfill or wafer level underfill and solder columns | Claudius Feger, Jae-Woong Nah, Da-Yuan Shih | 2015-02-24 |
| 8877566 | Curvilinear heat spreader/lid with improved heat dissipation | Maurice McGlashan-Powell, Soojae Park, Edward J. Yarmchuk | 2014-11-04 |