Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11500156 | Managing adhesive curing for photonic system assembly | Daniel Asselin, Raphael Beaupré-Laflamme, Luc Belanger, Simon-Pierre Pelletier | 2022-11-15 |
| 9042120 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Salvas +1 more | 2015-05-26 |
| 8614900 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Salvas +1 more | 2013-12-24 |
| 8492171 | Techniques and structures for testing integrated circuits in flip-chip assemblies | Michel Deschenes, Marco Gauvin | 2013-07-23 |