Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492171 | Techniques and structures for testing integrated circuits in flip-chip assemblies | Michel Deschenes, Eric Giguere | 2013-07-23 |
| 7482180 | Method for determining the impact of layer thicknesses on laminate warpage | Julien Sylvestre, Jean Audet, Sylvain Pharand | 2009-01-27 |
| 6137158 | Leadframe and leadframe assembly for parallel optical computer link | Mitchell S. Cohen, Glen Walden Johnson, Daniel M. Kuchta, Andre Lacerte, Nicholas A. Lee +4 more | 2000-10-24 |
| 5781682 | Low-cost packaging for parallel optical computer link | Mitchell S. Cohen, Glen Walden Johnson, Daniel M. Kuchta, Andre Lacerte, Nicholas A. Lee +4 more | 1998-07-14 |