Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11388821 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Francesco Preda | 2022-07-12 |
| 11209598 | Photonics package with face-to-face bonding | Barnim Alexander Janta-Polczynski, Isabel De Sousa, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire +2 more | 2021-12-28 |
| 10949600 | Semiconductor package floating metal checks | Franklin M. Baez, Jason L. Frankel, Paul R. Walling | 2021-03-16 |
| 10813215 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada | 2020-10-20 |
| 10806030 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada | 2020-10-13 |
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Francois Arguin, Luc Guerin, Maryse Cournoyer, Steve Whitehead, Richard Langlois +3 more | 2020-09-22 |
| 10706204 | Automated generation of surface-mount package design | Alain Ayotte, Franklin M. Baez, Anson J. Call, Deana Cosmadelis, Jason L. Frankel +5 more | 2020-07-07 |
| 10687420 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada | 2020-06-16 |
| 10660209 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Francesco Preda | 2020-05-19 |
| 10622299 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2020-04-14 |
| 10460956 | Interposer with lattice construction and embedded conductive metal structures | Benjamin V. Fasano, Shidong Li | 2019-10-29 |
| 10423751 | Semiconductor package floating metal checks | Franklin M. Baez, Jason L. Frankel, Paul R. Walling | 2019-09-24 |
| 10224274 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10224273 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10211174 | Flip chip assembly with connected component | Luc Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2019-02-19 |
| 9984988 | Flip chip assembly with connected component | Luc Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2018-05-29 |
| 9899313 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2018-02-20 |
| 9673064 | Interposer with lattice construction and embedded conductive metal structures | Benjamin V. Fasano, Shidong Li | 2017-06-06 |
| 9553079 | Flip chip assembly with connected component | Luc Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2017-01-24 |
| 9443799 | Interposer with lattice construction and embedded conductive metal structures | Benjamin V. Fasano, Shidong Li | 2016-09-13 |
| 8841209 | Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method | Sylvie Allard, Kevin A. Dore, Sylvain Pharand, David J. Russell | 2014-09-23 |
| 7886435 | High performance chip carrier substrate | Irving Memis | 2011-02-15 |
| 7868459 | Semiconductor package having non-aligned active vias | Luc Guerin, David L. Questad, David J. Russell | 2011-01-11 |
| 7863526 | High performance chip carrier substrate | Irving Memis | 2011-01-04 |
| 7786579 | Apparatus for crack prevention in integrated circuit packages | Anson J. Call, Steven P. Ostrander, Douglas O. Powell, Roger D. Weekly | 2010-08-31 |