Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10956649 | Semiconductor package metal shadowing checks | Anson J. Call, Francesco Preda | 2021-03-23 |
| 10949600 | Semiconductor package floating metal checks | Jean Audet, Franklin M. Baez, Jason L. Frankel | 2021-03-16 |
| 10706204 | Automated generation of surface-mount package design | Jean Audet, Alain Ayotte, Franklin M. Baez, Anson J. Call, Deana Cosmadelis +5 more | 2020-07-07 |
| 10546096 | Semiconductor package via stack checking | Anson J. Call | 2020-01-28 |
| 10423752 | Semiconductor package metal shadowing checks | Anson J. Call, Francesco Preda | 2019-09-24 |
| 10423751 | Semiconductor package floating metal checks | Jean Audet, Franklin M. Baez, Jason L. Frankel | 2019-09-24 |
| 10375820 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Roger D. Weekly | 2019-08-06 |
| 9955567 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Roger D. Weekly | 2018-04-24 |
| 8927879 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Roger D. Weekly | 2015-01-06 |
| 8756546 | Elastic modulus mapping of a chip carrier in a flip chip package | Erwin B. Cohen, Mark C. H. Lamorey, Marek A. Orlowski, Douglas O. Powell, David L. Questad +1 more | 2014-06-17 |
| 7325213 | Nested design approach | Harsaran S. Bhatia, Marie Cole, Michael S. Cranmer, Jason L. Frankel, Eric V. Kline +1 more | 2008-01-29 |
| 7096451 | Mesh plane generation and file storage | Alice L. Donaldson, Jason L. Frankel, John A. Ludwig, Kenneth A. Papae, Rafael Perez-Acevedo +1 more | 2006-08-22 |
| 6528735 | Substrate design of a chip using a generic substrate design | Harsaran S. Bhatia, Raymond Morris Bryant, Suresh D. Kadakia, David C. Long | 2003-03-04 |
| 6261467 | Direct deposit thin film single/multi chip module | Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller +1 more | 2001-07-17 |
| 6037044 | Direct deposit thin film single/multi chip module | Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller +1 more | 2000-03-14 |
| 5677847 | Method and apparatus for designing a module | — | 1997-10-14 |