| 12504747 |
Multicomponent module design and fabrication |
Kirk D. Peterson, Steven P. Ostrander, Stephanie Allard, Charles L. Reynolds, Daniel M. Dreps +8 more |
2025-12-23 |
|
| 12468293 |
Multicomponent module design and fabrication |
Kirk D. Peterson, Steven P. Ostrander, Stephanie Allard, Charles L. Reynolds, Daniel M. Dreps +8 more |
2025-11-11 |
|
| 12266598 |
Dense via pitch interconnect to increase wiring density |
Francesco Preda, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Nam H. Pham +2 more |
2025-04-01 |
|
| 11658378 |
Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) |
Joshua C. Myers, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Wiren D. Becker +1 more |
2023-05-23 |
$8,730,000 |
| 11399428 |
PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication |
Pavel Roy Paladhi, Jose A. Hejase, Junyan Tang, Joshua C. Myers, Wiren D. Becker +1 more |
2022-07-26 |
$16,337,000 |
| 10657308 |
Signal via positioning in a multi-layer circuit board |
Matteo Cocchini, Michael A. Cracraft |
2020-05-19 |
$2,035,000 |
| 10375820 |
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures |
Jinwoo Choi, Jason L. Frankel, Paul R. Walling, Roger D. Weekly |
2019-08-06 |
$1,880,000 |
| 10223490 |
Signal via positioning in a multi-layer circuit board using a genetic via placement solver |
Matteo Cocchini, Michael A. Cracraft |
2019-03-05 |
$2,050,000 |
| 10216884 |
Signal via positioning in a multi-layer circuit board using a genetic via placement solver |
Matteo Cocchini, Michael A. Cracraft |
2019-02-26 |
$2,499,000 |
| 10135162 |
Method for fabricating a hybrid land grid array connector |
Jose A. Hejase, Wiren D. Becker, Daniel M. Dreps, Brian S. Beaman |
2018-11-20 |
$2,951,000 |
| 10128593 |
Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body |
Jose A. Hejase, Wiren D. Becker, Daniel M. Dreps, Brian S. Beaman |
2018-11-13 |
$2,931,000 |
| 9980382 |
Method of making a printed circuit board copper plane repair |
Mahesh Bohra, Jesus Montanez, Daniel I. Rodriguez |
2018-05-22 |
$7,737,000 |
| 9955567 |
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures |
Jinwoo Choi, Jason L. Frankel, Paul R. Walling, Roger D. Weekly |
2018-04-24 |
$2,845,000 |
| 9940426 |
Signal via positioning in a multi-layer circuit board |
Matteo Cocchini, Michael A. Cracraft |
2018-04-10 |
$2,135,000 |
| 9916410 |
Signal via positioning in a multi-layer circuit board |
Matteo Cocchini, Michael A. Cracraft |
2018-03-13 |
$2,527,000 |
| 9881115 |
Signal via positioning in a multi-layer circuit board using a genetic via placement solver |
Matteo Cocchini, Michael A. Cracraft |
2018-01-30 |
$2,622,000 |
| 9875331 |
Signal via positioning in a multi-layer circuit board using a genetic via placement solver |
Matteo Cocchini, Michael A. Cracraft |
2018-01-23 |
$4,886,000 |
| 9485866 |
Printed circuit board copper plane repair |
Mahesh Bohra, Jesus Montanez, Daniel I. Rodriguez |
2016-11-01 |
$3,150,000 |
| 9477568 |
Managing interconnect electromigration effects |
Malcolm S. Allen-Ware, Jon A. Casey, Alan J. Drake, Charles R. Lefurgy, Karthick Rajamani +3 more |
2016-10-25 |
$7,053,000 |
| 9374910 |
Printed circuit board copper plane repair |
Mahesh Bohra, Jesus Montanez, Daniel I. Rodriguez |
2016-06-21 |
$3,815,000 |
| 9357649 |
276-pin buffered memory card with enhanced memory system interconnect |
Brian J. Connolly |
2016-05-31 |
$4,553,000 |
| 8962475 |
Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density |
Anand Haridass, Roger D. Weekly |
2015-02-24 |
$3,851,000 |
| 8927879 |
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures |
Jinwoo Choi, Jason L. Frankel, Paul R. Walling, Roger D. Weekly |
2015-01-06 |
$2,134,000 |
| 8813000 |
System for designing substrates having reference plane voids with strip segments |
Anand Haridass, Roger D. Weekly |
2014-08-19 |
$3,895,000 |
| 8645889 |
Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules |
Jinwoo Choi, Anand Haridass, Roger D. Weekly |
2014-02-04 |
$4,435,000 |
