| 12266598 |
Dense via pitch interconnect to increase wiring density |
Francesco Preda, Sungjun Chun, Jose A. Hejase, Pavel Roy Paladhi, Nam H. Pham +2 more |
2025-04-01 |
| 11658378 |
Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) |
Joshua C. Myers, Jose A. Hejase, Pavel Roy Paladhi, Wiren D. Becker, Sungjun Chun +1 more |
2023-05-23 |
| 11399428 |
PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication |
Pavel Roy Paladhi, Jose A. Hejase, Joshua C. Myers, Sungjun Chun, Wiren D. Becker +1 more |
2022-07-26 |
| 10879575 |
Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures |
Joshua C. Myers, Jose A. Hejase, Daniel M. Dreps |
2020-12-29 |
| 10199706 |
Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes |
Samuel R. Connor, Daniel M. Dreps, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers |
2019-02-05 |
| 10181628 |
Reduction of crosstalk between dielectric waveguides using split ring resonators |
Daniel M. Dreps, Jose A. Hejase, Joshua C. Myers |
2019-01-15 |
| 10141623 |
Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board |
Samuel R. Connor, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers |
2018-11-27 |
