Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266598 | Dense via pitch interconnect to increase wiring density | Francesco Preda, Sungjun Chun, Junyan Tang, Pavel Roy Paladhi, Nam H. Pham +2 more | 2025-04-01 |
| 11658378 | Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) | Joshua C. Myers, Junyan Tang, Pavel Roy Paladhi, Wiren D. Becker, Sungjun Chun +1 more | 2023-05-23 |
| 11399428 | PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication | Pavel Roy Paladhi, Junyan Tang, Joshua C. Myers, Sungjun Chun, Wiren D. Becker +1 more | 2022-07-26 |
| 10879575 | Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures | Joshua C. Myers, Junyan Tang, Daniel M. Dreps | 2020-12-29 |
| 10620253 | Noise modulation for on-chip noise measurement | Nanju Na, Nam H. Pham, Lloyd A. Walls | 2020-04-14 |
| 10199706 | Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes | Samuel R. Connor, Daniel M. Dreps, Joseph Kuczynski, Joshua C. Myers, Junyan Tang | 2019-02-05 |
| 10181628 | Reduction of crosstalk between dielectric waveguides using split ring resonators | Daniel M. Dreps, Joshua C. Myers, Junyan Tang | 2019-01-15 |
| 10167879 | Cooling fan coupled with a set of recirculation flaps | Ethan E. Cruz, Howard Victor Mahaney, Jr., Joel Mendez | 2019-01-01 |
| 10167878 | Cooling fan coupled with a set of recirculation flaps | Ethan E. Cruz, Howard Victor Mahaney, Jr., Joel Mendez | 2019-01-01 |
| 10141623 | Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board | Samuel R. Connor, Joseph Kuczynski, Joshua C. Myers, Junyan Tang | 2018-11-27 |
| 10135162 | Method for fabricating a hybrid land grid array connector | Wiren D. Becker, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-20 |
| 10128593 | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body | Wiren D. Becker, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-13 |
| 9893400 | Method for performing frequency band splitting | Rubina F. Ahmed, Daniel M. Dreps, James D. Jordan, Nam H. Pham, Lloyd A. Walls | 2018-02-13 |
| 9835665 | Noise modulation for on-chip noise measurement | Nanju Na, Nam H. Pham, Lloyd A. Walls | 2017-12-05 |
| 9797938 | Noise modulation for on-chip noise measurement | Nanju Na, Nam H. Pham, Lloyd A. Walls | 2017-10-24 |
| 9733305 | Frequency-domain high-speed bus signal integrity compliance model | Wiren D. Becker, Daniel M. Dreps, Glen A. Wiedemeier, Si T. Win | 2017-08-15 |
| 9686053 | Frequency-domain high-speed bus signal integrity compliance model | Wiren D. Becker, Daniel M. Dreps, Glen A. Wiedemeier, Si T. Win | 2017-06-20 |
| 9673941 | Frequency-domain high-speed bus signal integrity compliance model | Wiren D. Becker, Daniel M. Dreps, Glen A. Wiedemeier, Si T. Win | 2017-06-06 |
| 9638750 | Frequency-domain high-speed bus signal integrity compliance model | Wiren D. Becker, Daniel M. Dreps, Glen A. Wiedemeier, Si T. Win | 2017-05-02 |
| 9368852 | Method for performing frequency band splitting | Rubina F. Ahmed, Daniel M. Dreps, James D. Jordan, Nam H. Pham, Lloyd A. Walls | 2016-06-14 |