| 12266598 |
Dense via pitch interconnect to increase wiring density |
Francesco Preda, Sungjun Chun, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi +2 more |
2025-04-01 |
|
| 11658378 |
Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) |
Joshua C. Myers, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Sungjun Chun +1 more |
2023-05-23 |
$8,730,000 |
| 11399428 |
PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication |
Pavel Roy Paladhi, Jose A. Hejase, Junyan Tang, Joshua C. Myers, Sungjun Chun +1 more |
2022-07-26 |
$16,337,000 |
| 11133259 |
Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network |
Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Steven L. Wright, Xiao Hu Liu |
2021-09-28 |
$6,479,000 |
| 10257599 |
Slack and strain control mechanism |
Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain |
2019-04-09 |
$2,400,000 |
| 10247489 |
Structural dynamic heat sink |
Bjorn J. Ahbel, Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain |
2019-04-02 |
$2,364,000 |
| 10135162 |
Method for fabricating a hybrid land grid array connector |
Jose A. Hejase, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman |
2018-11-20 |
$2,951,000 |
| 10128593 |
Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body |
Jose A. Hejase, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman |
2018-11-13 |
$2,931,000 |
| 9733305 |
Frequency-domain high-speed bus signal integrity compliance model |
Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win |
2017-08-15 |
$1,588,000 |
| 9686053 |
Frequency-domain high-speed bus signal integrity compliance model |
Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win |
2017-06-20 |
$2,315,000 |
| 9673941 |
Frequency-domain high-speed bus signal integrity compliance model |
Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win |
2017-06-06 |
$2,871,000 |
| 9644907 |
Structurally dynamic heat sink |
Bjorn J. Ahbel, Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain |
2017-05-09 |
$2,584,000 |
| 9638750 |
Frequency-domain high-speed bus signal integrity compliance model |
Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win |
2017-05-02 |
$3,833,000 |
| 9627787 |
DIMM connector region vias and routing |
William L. Brodsky, Matteo Cocchini, Michael A. Cracraft |
2017-04-18 |
$1,813,000 |
| 9625220 |
Structurally dynamic heat sink |
Bjorn J. Ahbel, Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain |
2017-04-18 |
$1,813,000 |
| 9548551 |
DIMM connector region vias and routing |
William L. Brodsky, Matteo Cocchini, Michael A. Cracraft |
2017-01-17 |
$4,498,000 |
| 9444162 |
DIMM connector region vias and routing |
William L. Brodsky, Matteo Cocchini, Michael A. Cracraft |
2016-09-13 |
$4,023,000 |
| 9052880 |
Multi-level interconnect apparatus |
Alan F. Becker, William L. Brodsky, John G. Torok |
2015-06-09 |
$3,292,000 |
| 8683413 |
Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost |
Jinwoo Choi, Tingdong Zhou |
2014-03-25 |
$4,381,000 |
| 8339803 |
High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost |
Jinwoo Choi, Tingdong Zhou |
2012-12-25 |
|
| 8295419 |
Method and apparatus for generating synchronization signals for synchronizing multiple chips in a system |
Charlie C. Hwang, Timothy G. McNamara, Ching-Lung Tong |
2012-10-23 |
$6,526,000 |
| 8261226 |
Network flow based module bottom surface metal pin assignment |
Ruchir Puri, Haoxing Ren, Hua Xiang, Tingdong Zhou |
2012-09-04 |
$6,762,000 |
| 8050174 |
Self-healing chip-to-chip interface |
Daniel M. Dreps, Frank D. Ferraiolo, Anand Haridass, Robert J. Reese |
2011-11-01 |
$20,462,000 |
| 8018837 |
Self-healing chip-to-chip interface |
Daniel M. Dreps, Frank D. Ferraiolo, Anand Haridass, Robert J. Reese |
2011-09-13 |
$4,804,000 |
| 7987587 |
Method of forming solid vias in a printed circuit board |
Michael F. McAllister, Alan Daniel Stigliani, John G. Torok |
2011-08-02 |
$4,890,000 |
