Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8929086 | Gel package structural enhancement of compression system board connections | Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor | 2015-01-06 |
| 8796140 | Hybrid conductor through-silicon-via for power distribution and signal transmission | Xiaoxiong Gu | 2014-08-05 |
| 8791550 | Hybrid conductor through-silicon-via for power distribution and signal transmission | Xiaoxiong Gu | 2014-07-29 |
| 8785289 | Integrated decoupling capacitor employing conductive through-substrate vias | Tae Hong Kim, Michael J. Shapiro, Edmund J. Sprogis | 2014-07-22 |
| 8558345 | Integrated decoupling capacitor employing conductive through-substrate vias | Tae Hong Kim, Edmund J. Sprogis, Michael J. Shapiro | 2013-10-15 |
| 7987587 | Method of forming solid vias in a printed circuit board | Wiren D. Becker, Alan Daniel Stigliani, John G. Torok | 2011-08-02 |
| 7930820 | Method for structural enhancement of compression system board connections | Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor | 2011-04-26 |
| 7543373 | Gel package structural enhancement of compression system board connections | Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor | 2009-06-09 |
| 7363688 | Land grid array structures and methods for engineering change | John G. Torok | 2008-04-29 |
| 7344919 | Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener | Harald Pross, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor | 2008-03-18 |
| 7284992 | Electronic package structures using land grid array interposers for module-to-board interconnection | Wiren D. Becker, William L. Brodsky, Evan G. Colgan, Edward J. Seminaro, John G. Torok | 2007-10-23 |
| 7077660 | Land grid array structures and methods for engineering change | John G. Torok | 2006-07-18 |
| 6954984 | Land grid array structure | John G. Torok | 2005-10-18 |
| 6605953 | Method and apparatus of interconnecting with a system board | Klaus Kempter, Charles F. Pells, Stephan Richter, Gerhard Ruehle | 2003-08-12 |
| 6549024 | Method of interconnecting with a system board | Klaus Kempter, Charles F. Pells, Stephan Richter, Gerhard Ruehle | 2003-04-15 |
| 6538460 | Method and apparatus for enhancing a system board | Klaus Kempter, Charles F. Pells, Stephan Richter, Gerhard Ruehle | 2003-03-25 |
| 6529023 | Application and test methodology for use with compression land grid array connectors | Wiren D. Becker, Gerhard Ruehle | 2003-03-04 |
| 6462573 | System interface assembly and method | Klaus Kempter, Charles F. Pells, Stephan Richter, Gerhard Ruehle | 2002-10-08 |
| 6444919 | Thin film wiring scheme utilizing inter-chip site surface wiring | Laertis Economikos, Mukta S. Farooq, Eric D. Perfecto, Chandrika Prasad, Keshav Prasad +3 more | 2002-09-03 |
| 6433562 | Method and apparatus of interconnecting with a system board | Klaus Kempter, Charles F. Pells, Stephan Richter, Gerhard Ruehle | 2002-08-13 |
| 6429644 | Method and apparatus of interconnecting with a system board | Klaus Kempter, Charles F. Pells, Stephan Richter, Gerhard Ruehle | 2002-08-06 |
| 6342788 | Probing systems for chilled environment | Gerhard Ruehle | 2002-01-29 |
| 6252391 | High frequency probe | Klaus Kempter, Charles F. Pells, Stephan Richter, Gerhard Ruehle | 2001-06-26 |
| 5817543 | Method of constructing an integrated circuit memory | James A. McDonald, Gordon J. Robbins, Madhavan Swaminathan, Gregory Martine Wilkins | 1998-10-06 |
| 5757079 | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure | James A. McDonald, Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins +2 more | 1998-05-26 |