Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8929086 | Gel package structural enhancement of compression system board connections | Michael F. McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz | 2015-01-06 |
| 7930820 | Method for structural enhancement of compression system board connections | Michael F. McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz | 2011-04-26 |
| 7543373 | Gel package structural enhancement of compression system board connections | Michael F. McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz | 2009-06-09 |
| 7344919 | Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener | Michael F. McAllister, Harald Pross, Gerhard Ruehle, Wolfgang Scholz | 2008-03-18 |