| 10838816 |
Detecting and sparing of optical PCIE cable channel attached IO drawer |
Jesse P. Arroyo, Ellen M. Bauman, Timothy R. Block, Christoper J. Engel, Kaveh Naderi +2 more |
2020-11-17 |
| 9891998 |
Detecting and sparing of optical PCIE cable channel attached IO drawer |
Jesse P. Arroyo, Ellen M. Bauman, Timothy R. Block, Christopher J. Engel, Kaveh Naderi +2 more |
2018-02-13 |
| 9697155 |
Detecting and configuring of external IO enclosure |
Jesse P. Arroyo, Ellen M. Bauman, Curtis S. Eide, Christopher J. Engel, Gregory M. Nordstrom +2 more |
2017-07-04 |
| 9697167 |
Implementing health check for optical cable attached PCIE enclosure |
Jesse P. Arroyo, Ellen M. Bauman, Timothy R. Block, Christopher J. Engel, Kaveh Naderi +1 more |
2017-07-04 |
| 9697156 |
Detecting and configuring of external IO enclosure |
Jesse P. Arroyo, Ellen M. Bauman, Curtis S. Eide, Christopher J. Engel, Gregory M. Nordstrom +2 more |
2017-07-04 |
| 9697166 |
Implementing health check for optical cable attached PCIE enclosure |
Jesse P. Arroyo, Ellen M. Bauman, Timothy R. Block, Christopher J. Engel, Kaveh Naderi +1 more |
2017-07-04 |
| 9582366 |
Detecting and sparing of optical PCIE cable channel attached IO drawer |
Jesse P. Arroyo, Ellen M. Bauman, Timothy R. Block, Christopher J. Engel, Kaveh Naderi +2 more |
2017-02-28 |
| 9384104 |
Testing a processor assembly |
Daniel M. Crowell, James Stephen Fields, Jr., Richard B. Finch, Gerald G. Stanquist |
2016-07-05 |
| 8929086 |
Gel package structural enhancement of compression system board connections |
Michael F. McAllister, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor |
2015-01-06 |
| 7930820 |
Method for structural enhancement of compression system board connections |
Michael F. McAllister, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor |
2011-04-26 |
| 7543373 |
Gel package structural enhancement of compression system board connections |
Michael F. McAllister, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor |
2009-06-09 |
| 7344919 |
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener |
Michael F. McAllister, Gerhard Ruehle, Wolfgang Scholz, Gerhard Schoor |
2008-03-18 |
| 6646888 |
Low inductance multiple resistor EC capacitor pad |
Manfred Cwik, Rene Schrottenholzer |
2003-11-11 |
| 5227995 |
High density semiconductor memory module using split finger lead frame |
Erich Klink, Helmut Kohler |
1993-07-13 |
