| 6489686 |
Multi-cavity substrate structure for discrete devices |
John U. Knickerbocker, Srinivasa S. N. Reddy |
2002-12-03 |
| 6461493 |
Decoupling capacitor method and structure using metal based carrier |
Shaji Farooq, John U. Knickerbocker, Robert A. Rita, Srinivasa N. Reddy |
2002-10-08 |
| 6444919 |
Thin film wiring scheme utilizing inter-chip site surface wiring |
Laertis Economikos, Michael F. McAllister, Eric D. Perfecto, Chandrika Prasad, Keshav Prasad +3 more |
2002-09-03 |
| 6430030 |
High k dielectric material with low k dielectric sheathed signal vias |
Harvey C. Hamel, Robert A. Rita, Herbert I. Stoller |
2002-08-06 |
| 6339527 |
Thin film capacitor on ceramic |
John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita, Roy R. Yu |
2002-01-15 |
| 6335210 |
Baseplate for chip burn-in and/of testing, and method thereof |
Raymond A. Jackson, Sarah H. Knickerbocker, Sudipta K. Ray |
2002-01-01 |
| 6333563 |
Electrical interconnection package and method thereof |
Raymond A. Jackson, Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Shaji Farooq +3 more |
2001-12-25 |
| 6281692 |
Interposer for maintaining temporary contact between a substrate and a test bed |
Paul F. Bodenweber, Ralph R. Comulada, Jr., Charles J. Hendricks, Philo B. Hodge, Vincent P. Peterson +3 more |
2001-08-28 |
| 6255827 |
Search routine for 2-point electrical tester |
Vincent P. Peterson, Kathleen M. Wiley |
2001-07-03 |
| 6226863 |
Reworkability method for wirebond chips using high performance capacitor |
Raymond A. Jackson, Sudipta K. Ray |
2001-05-08 |
| 6228682 |
Multi-cavity substrate structure for discrete devices |
John U. Knickerbocker, Srinivasa S. N. Reddy |
2001-05-08 |
| 6216324 |
Method for a thin film multilayer capacitor |
Shaji Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita, Herbert I. Stoller |
2001-04-17 |
| 6210545 |
Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target |
Robert A. Rita, Stephen M. Rossnagel |
2001-04-03 |
| 6200400 |
Method for making high k dielectric material with low k dielectric sheathed signal vias |
Harvey C. Hamel, Robert A. Rita, Herbert I. Stoller |
2001-03-13 |
| 6178082 |
High temperature, conductive thin film diffusion barrier for ceramic/metal systems |
David E. Kotecki, Robert A. Rita, Stephen M. Rossnagel |
2001-01-23 |
| 6072690 |
High k dielectric capacitor with low k sheathed signal vias |
Harvey C. Hamel, Robert A. Rita, Herbert I. Stoller |
2000-06-06 |
| 6023407 |
Structure for a thin film multilayer capacitor |
Shaji Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita, Herbert I. Stoller |
2000-02-08 |
| 6015955 |
Reworkability solution for wirebound chips using high performance capacitor |
Raymond A. Jackson, Sudipta K. Ray |
2000-01-18 |
| 5912044 |
Method for forming thin film capacitors |
Ajay P. Giri, Rajesh S. Patel |
1999-06-15 |
| 5898222 |
Capped copper electrical interconnects |
Suryanarayana Kaja, Eric D. Perfecto, George E. White |
1999-04-27 |
| 5874369 |
Method for forming vias in a dielectric film |
Mark J. LaPlante |
1999-02-23 |
| 5705857 |
Capped copper electrical interconnects |
Suryanarayana Kaja, Eric D. Perfecto, George E. White |
1998-01-06 |
| 5549808 |
Method for forming capped copper electrical interconnects |
Suryanarayana Kaja, Eric D. Perfecto, George E. White |
1996-08-27 |
| 5545927 |
Capped copper electrical interconnects |
Suryanarayana Kaja, Eric D. Perfecto, George E. White |
1996-08-13 |
| 5266446 |
Method of making a multilayer thin film structure |
Kenneth Chang, George Czornyj, Ananda H. Kumar, Marvin S. Pitler, Heinz O. Steimel |
1993-11-30 |
