Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11825592 | Electronic device console with natural draft cooling | Kamal K. Sikka, Chenzhou Lian, Kathryn C. Rivera, Jon A. Casey | 2023-11-21 |
| 11035625 | Adjustable heat sink fin spacing | Kamal K. Sikka | 2021-06-15 |
| 10948247 | Adjustable heat sink fin spacing | Kamal K. Sikka | 2021-03-16 |
| 10905029 | Cooling structure for electronic boards | Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2021-01-26 |
| 10834808 | Electronic device console with natural draft cooling | Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka | 2020-11-10 |
| 10757833 | Cooling structure for electronic boards | Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2020-08-25 |
| 10584924 | Adjustable heat sink fin spacing | Kamal K. Sikka | 2020-03-10 |
| 10542636 | Cooling structure for electronic boards | Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2020-01-21 |
| 10172258 | Cooling structure for electronic boards | Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2019-01-01 |
| 10088244 | Adjustable heat sink fin spacing | Kamal K. Sikka | 2018-10-02 |
| 9921008 | Adjustable heat sink fin spacing | Kamal K. Sikka | 2018-03-20 |
| 9735083 | Adjustable heat sink fin spacing | Kamal K. Sikka | 2017-08-15 |
| 9721870 | Cooling structure for electronic boards | Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2017-08-01 |
| 9401315 | Thermal hot spot cooling for semiconductor devices | Taryn J. Davis, Marcus E. Interrante, Chenzhou Lian, Kenneth C. Marston, Kathryn C. Rivera +2 more | 2016-07-26 |
| 9366591 | Determining magnitude of compressive loading | Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2016-06-14 |
| 9226426 | Electronic device console with natural draft cooling | Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka | 2015-12-29 |
| 9105500 | Non-hermetic sealed multi-chip module package | Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz | 2015-08-11 |
| 8794079 | Determining magnitude of compressive loading | Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2014-08-05 |
| 8717043 | Determining thermal interface material (TIM) thickness change | Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2014-05-06 |
| 7913379 | Tool assembly for extracting and installing dual in-line memory module cardlets | John J. Loparco, Thong N. Nguyen, Thomas Ramundo, John G. Torok | 2011-03-29 |
| 7118385 | Apparatus for implementing a self-centering land grid array socket | David C. Long, Jason S. Miller, Robert P. Westerfield, Jr., Yuet-Ying Yu | 2006-10-10 |
| 6984997 | Method and system for testing multi-chip integrated circuit modules | Yuet-Ying Yu, Charles J. Hendricks, Frank C. Seelmann | 2006-01-10 |
| 6281692 | Interposer for maintaining temporary contact between a substrate and a test bed | Ralph R. Comulada, Jr., Mukta S. Farooq, Charles J. Hendricks, Philo B. Hodge, Vincent P. Peterson +3 more | 2001-08-28 |
| 5898311 | Shorting pad having a flexible conductive sheet | Robert Charles Polacco, Yuet-Ying Yu | 1999-04-27 |