Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9543253 | Method for shaping a laminate substrate | Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss | 2017-01-10 |
| 9536805 | Power management integrated circuit (PMIC) integration into a processor package | Siamak Fazelpour, Mario Francisco Velez, Sun Hyuck Yun, Rajneesh Kumar, Houssam Jomaa | 2017-01-03 |
| 9366591 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jeffrey A. Zitz | 2016-06-14 |
| 9059240 | Fixture for shaping a laminate substrate | Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss | 2015-06-16 |
| 9048245 | Method for shaping a laminate substrate | Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss | 2015-06-02 |
| 8794079 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jeffrey A. Zitz | 2014-08-05 |
| 8717043 | Determining thermal interface material (TIM) thickness change | Paul F. Bodenweber, Virendra R. Jadhav, Kamal K. Sikka, Jeffrey A. Zitz | 2014-05-06 |
| 8299608 | Enhanced thermal management of 3-D stacked die packaging | Gerald K. Bartley, David R. Motschman, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei | 2012-10-30 |
| 8232636 | Reliability enhancement of metal thermal interface | James N. Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan +4 more | 2012-07-31 |
| 7875972 | Semiconductor device assembly having a stress-relieving buffer layer | Virendra R. Jadhav, Kamal K. Sikka | 2011-01-25 |
| 7834442 | Electronic package method and structure with cure-melt hierarchy | Bruce K. Furman, Kenneth C. Marston, Jeffrey A. Zitz | 2010-11-16 |
| 7812438 | Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging | Virendra R. Jadhav, David L. Questad, Kamal K. Sikka, Xiaojin Wei | 2010-10-12 |
| 7733655 | Lid edge capping load | Martin Beaumier, Mohamed Belazzouz, Peter J. Brofman, David L. Edwards, Kamal K. Sikka +1 more | 2010-06-08 |