| 11280968 |
High-bandwidth embedded optical connector with latching mechanism |
Barnim Alexander Janta-Polczynski, Elaine Cyr, Paul F. Fortier |
2022-03-22 |
| 10784202 |
High-density chip-to-chip interconnection with silicon bridge |
Francois Arguin, Luc Guerin, Maryse Cournoyer, Steve Whitehead, Jean Audet +3 more |
2020-09-22 |
| 10679966 |
Gallium liquid metal embrittlement for device rework |
David Danovitch, Yolande Elodie Nguena Dongmo |
2020-06-09 |
| 10559549 |
Gallium liquid metal embrittlement for device rework |
David Danovitch, Yolande Elodie Nguena Dongmo |
2020-02-11 |
| 10338325 |
Nanofiller in an optical interface |
Barnim Alexander Janta-Polczynski, Tymon Barwicz, Elaine Cyr, Nicolas Boyer, Marie-Claude Paquet +1 more |
2019-07-02 |
| 10302869 |
Optical interconnect attach to photonic device with partitioning adhesive function |
Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Nicolas Boyer, Paul F. Fortier |
2019-05-28 |
| 10295749 |
Optical interconnect attach to photonic device with partitioning adhesive function |
Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Nicolas Boyer, Paul F. Fortier |
2019-05-21 |
| 10211174 |
Flip chip assembly with connected component |
Jean Audet, Luc Guerin, Stephan L. Martel, Sylvain E. Ouimet |
2019-02-19 |
| 9984988 |
Flip chip assembly with connected component |
Jean Audet, Luc Guerin, Stephan L. Martel, Sylvain E. Ouimet |
2018-05-29 |
| 9553079 |
Flip chip assembly with connected component |
Jean Audet, Luc Guerin, Stephan L. Martel, Sylvain E. Ouimet |
2017-01-24 |
| 8232636 |
Reliability enhancement of metal thermal interface |
James N. Humenik, Sushumna Iruvanti, Hsichang Liu, Govindarajan Natarajan, Kamal K. Sikka +4 more |
2012-07-31 |
| 7038462 |
Method and apparatus for electrical commoning of circuits |
David Danovitch, Martin Lapointe, Robert-Paul Leclerc |
2006-05-02 |
