Issued Patents All Time
Showing 25 most recent of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11882645 | Multi chip hardware security module | James A. Busby, Philipp K Buchling Rego, Steven P. Ostrander, Thomas A. Wassick, William Santiago-Fernandez +1 more | 2024-01-23 |
| 11569181 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Shidong Li, Steve Ostrander, Jon A. Casey, Brian R. Sundlof | 2023-01-31 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li | 2022-04-12 |
| 11264306 | Hybrid TIMs for electronic package cooling | Kamal K. Sikka, Piyas Bal Chowdhury, James J. Kelly, Jeffrey A. Zitz, Shidong Li | 2022-03-01 |
| 11158562 | Conformal integrated circuit (IC) device package lid | David J. Lewison, Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz | 2021-10-26 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Charles L. Arvin, Kevin Drummond, Kenneth C. Marston, Chris Muzzy | 2021-10-19 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Shidong Li, Steve Ostrander, Jon A. Casey, Brian R. Sundlof | 2021-01-12 |
| 10804181 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Marcus E. Interrante, Shidong Li, Tuhin Sinha | 2020-10-13 |
| 10636746 | Method of forming an electronic package | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li | 2020-04-28 |
| 10607928 | Reduction of laminate failure in integrated circuit (IC) device carrier | Anson J. Call, Shidong Li, Brian W. Quinlan, Kamal K. Sikka, Rui Wang | 2020-03-31 |
| 10593564 | Lid attach optimization to limit electronic package warpage | Shidong Li, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2020-03-17 |
| 10381276 | Test cell for laminate and method | Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha, Krishna R. Tunga +3 more | 2019-08-13 |
| 10332813 | Lid attach optimization to limit electronic package warpage | Shidong Li, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2019-06-25 |
| 10249548 | Test cell for laminate and method | Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha, Krishna R. Tunga +3 more | 2019-04-02 |
| 10083886 | Lid attach optimization to limit electronic package warpage | Shidong Li, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2018-09-25 |
| 10049896 | Lid attach optimization to limit electronic package warpage | Shidong Li, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2018-08-14 |
| 9947603 | Lid attach optimization to limit electronic package warpage | Shidong Li, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2018-04-17 |
| 9512291 | High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites | Theodorian Borca-Tasciuc, Fengyuan Lai, Kamyar Pashayi, Joel L. Plawsky, Hafez Raeisi-Fard | 2016-12-06 |
| 9045674 | High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites | Theodorian Borca-Tasciuc, Hafez Raeisi-Fard, Fengyuan Lai, Kamyar Pashayi, Joel L. Plawsky | 2015-06-02 |
| 8531025 | Thermal paste containment for semiconductor modules | David L. Edwards, Hilton T. Toy, Wei Zou | 2013-09-10 |
| 8455998 | Method and package for circuit chip packaging | Yves Martin, Theodore Kessel, Xiaojin Wei | 2013-06-04 |
| 8232636 | Reliability enhancement of metal thermal interface | James N. Humenik, Richard Langlois, Hsichang Liu, Govindarajan Natarajan, Kamal K. Sikka +4 more | 2012-07-31 |
| 8156998 | Patterned metal thermal interface | Bruce K. Furman, Paul A. Lauro, Yves Martin, Da-Yuan Shih, Theodore G. van Kessel +1 more | 2012-04-17 |
| 8053284 | Method and package for circuit chip packaging | Yves Martin, Theodore Kessel, Xiaojin Wei | 2011-11-08 |
| 8021925 | Thermal paste containment for semiconductor modules | David L. Edwards, Hilton T. Toy, Wei Zou | 2011-09-20 |