| 10956649 |
Semiconductor package metal shadowing checks |
Francesco Preda, Paul R. Walling |
2021-03-23 |
$2,115,000 |
| 10770385 |
Connected plane stiffener within integrated circuit chip carrier |
Brian W. Quinlan, Krishna R. Tunga |
2020-09-08 |
$3,136,000 |
| 10706204 |
Automated generation of surface-mount package design |
Jean Audet, Alain Ayotte, Franklin M. Baez, Deana Cosmadelis, Jason L. Frankel +5 more |
2020-07-07 |
$3,757,000 |
| 10607928 |
Reduction of laminate failure in integrated circuit (IC) device carrier |
Sushumna Iruvanti, Shidong Li, Brian W. Quinlan, Kamal K. Sikka, Rui Wang |
2020-03-31 |
$1,667,000 |
| 10546096 |
Semiconductor package via stack checking |
Paul R. Walling |
2020-01-28 |
$1,679,000 |
| 10483233 |
Split ball grid array pad for multi-chip modules |
Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble |
2019-11-19 |
$5,772,000 |
| 10423752 |
Semiconductor package metal shadowing checks |
Francesco Preda, Paul R. Walling |
2019-09-24 |
$3,094,000 |
| 10276535 |
Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress |
Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga |
2019-04-30 |
$3,198,000 |
| 10276534 |
Reduction of solder interconnect stress |
Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga |
2019-04-30 |
$3,198,000 |
| 10108753 |
Laminate substrate thermal warpage prediction for designing a laminate substrate |
Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga |
2018-10-23 |
$2,704,000 |
| 9865557 |
Reduction of solder interconnect stress |
Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga |
2018-01-09 |
$3,907,000 |
| 9659131 |
Copper feature design for warpage control of substrates |
Edmund Blackshear, Vijayeshwar D. Khanna, Douglas O. Powell, David J. Russell |
2017-05-23 |
$8,404,000 |
| 9633914 |
Split ball grid array pad for multi-chip modules |
Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble |
2017-04-25 |
$1,937,000 |
| 9563732 |
In-plane copper imbalance for warpage prediction |
Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga |
2017-02-07 |
$2,910,000 |
| 9105535 |
Copper feature design for warpage control of substrates |
Edmund Blackshear, Vijayeshwar D. Khanna, Douglas O. Powell, David J. Russell |
2015-08-11 |
$2,160,000 |
| 7786579 |
Apparatus for crack prevention in integrated circuit packages |
Jean Audet, Steven P. Ostrander, Douglas O. Powell, Roger D. Weekly |
2010-08-31 |
$3,369,000 |
| 6584684 |
Method for assembling a carrier and a semiconductor device |
Peter J. Brofman, Jeffrey T. Coffin, Kathleen A. Stalter |
2003-07-01 |
$13,647,000 |
| 6333563 |
Electrical interconnection package and method thereof |
Raymond A. Jackson, Mark G. Courtney, Stephen A. DeLaurentis, Mukta S. Farooq, Shaji Farooq +3 more |
2001-12-25 |
|
| 6300164 |
Structure, materials, and methods for socketable ball grid |
Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter |
2001-10-09 |
$29,916,000 |
| 6297559 |
Structure, materials, and applications of ball grid array interconnections |
Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter |
2001-10-02 |
$27,385,000 |
| 6218629 |
Module with metal-ion matrix induced dendrites for interconnection |
Peter J. Brofman, Jeffrey T. Coffin, Kathleen A. Stalter |
2001-04-17 |
$20,042,000 |
| 6120885 |
Structure, materials, and methods for socketable ball grid |
Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter |
2000-09-19 |
$39,208,000 |
| 6114450 |
Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin |
Krishna G. Sachdev, Michael Berger, Frank Louis Pompeo Jr. |
2000-09-05 |
$37,092,000 |
| 5955543 |
Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin |
Krishna G. Sachdev, Michael Berger, Frank L. Pompeo |
1999-09-21 |
$27,467,000 |
| 5930597 |
Reworkable polymer chip encapsulant |
Stephen L. Buchwalter, Sushumna Iruvanti, Stanley J. Jasne, Frank L. Pompeo, Paul A. Zucco +1 more |
1999-07-27 |
$22,178,000 |
