Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6858111 | Conductive polymer interconnection configurations | Charles H. Perry, Lewis S. Goldmann, Gregory B. Martin | 2005-02-22 |
| 6552529 | Method and apparatus for interim assembly electrical testing of circuit boards | Benjamin V. Fasano | 2003-04-22 |
| 6333563 | Electrical interconnection package and method thereof | Raymond A. Jackson, Anson J. Call, Stephen A. DeLaurentis, Mukta S. Farooq, Shaji Farooq +3 more | 2001-12-25 |
| 6333104 | Conductive polymer interconnection configurations | Charles H. Perry, Lewis S. Goldmann, Gregory B. Martin | 2001-12-25 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more | 2001-09-04 |
| 6278184 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more | 2001-08-21 |
| 6253986 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more | 2001-07-03 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more | 2000-12-12 |
| 6070321 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more | 2000-06-06 |
| 5975409 | Ceramic ball grid array using in-situ solder stretch | Peter J. Brofman, Patrick A. Coico, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-11-02 |
| 5968670 | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Peter J. Brofman, Patrick A. Coico, James H. Covell, Shaji Farooq, Lewis S. Goldmann +6 more | 1999-10-19 |
| 5964396 | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Peter J. Brofman, Patrick A. Coico, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-10-12 |
| 5881945 | Multi-layer solder seal band for semiconductor substrates and process | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more | 1999-03-16 |
| 5881944 | Multi-layer solder seal band for semiconductor substrates | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more | 1999-03-16 |
| 5819402 | Method for cooling of chips using blind holes with customized depth | David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti, Charles Frederick Jones +2 more | 1998-10-13 |
| 5757620 | Apparatus for cooling of chips using blind holes with customized depth | David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti, Charles Frederick Jones +2 more | 1998-05-26 |
| 5724729 | Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials | Raed A. Sherif, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1998-03-10 |
| 5623394 | Apparatus for cooling of chips using a plurality of customized thermally conductive materials | Raed A. Sherif, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1997-04-22 |
| 5604978 | Method for cooling of chips using a plurality of materials | Raed A. Sherif, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1997-02-25 |
| 4715430 | Environmentally secure and thermally efficient heat sink assembly | Allen J. Arnold, Diane N. Kirby, Katherine H. Mis, Kerry L. Sutton | 1987-12-29 |