Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8697987 | Solar cell having front grid metallization that does not contact the active layers | Hector Cotal | 2014-04-15 |
| 6531653 | Low cost high solar flux photovoltaic concentrator receiver | Gregory S. Glenn | 2003-03-11 |
| 6459160 | Package with low stress hermetic seal | Lewis S. Goldmann, Eric D. Perfecto, William F. Shutler, Hilton T. Toy | 2002-10-01 |
| 6373133 | Multi-chip module and heat-sink cap combination | Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti +4 more | 2002-04-16 |
| 6350944 | Solar module array with reconfigurable tile | Karim S. Boutros | 2002-02-26 |
| 6342407 | Low stress hermetic seal | Lewis S. Goldmann, Eric D. Perfecto, William F. Shutler, Hilton T. Toy | 2002-01-29 |
| 6333460 | Structural support for direct lid attach | Hilton T. Toy, David J. Womac | 2001-12-25 |
| 6330157 | Variable thermal exchanger and method thereof | Raschid J. Bezama | 2001-12-11 |
| 6294408 | Method for controlling thermal interface gap distance | David L. Edwards, Michael Emmett, Sushumna Iruvanti, Kamal K. Sikka, Hilton T. Toy | 2001-09-25 |
| 6255139 | Method for providing a thermal path through particles embedded in a thermal cap | David L. Edwards, Patrick A. Coico, Sushumna Iruvanti, Frank L. Pompeo, Hilton T. Toy | 2001-07-03 |
| 6222263 | Chip assembly with load-bearing lid in thermal contact with the chip | Hilton T. Toy, David J. Womac | 2001-04-24 |
| 6218730 | Apparatus for controlling thermal interface gap distance | Hilton T. Toy | 2001-04-17 |
| 6111314 | Thermal cap with embedded particles | David L. Edwards, Patrick A. Coico, Sushumna Iruvanti, Frank L. Pompeo, Hilton T. Toy | 2000-08-29 |
| 6049456 | Electronic module adjustment design and process using shims | Gaetano P. Messina, Armando S. Cammarano, Patrick A. Coico, Ronald L. Hering, Eric B. Hultmark | 2000-04-11 |
| 5990418 | Hermetic CBGA/CCGA structure with thermal paste cooling | Kevin G. Bivona, Jeffrey T. Coffin, Stephen S. Drofitz, Jr., Lewis S. Goldmann, Mario J. Interrante +1 more | 1999-11-23 |
| 5981310 | Multi-chip heat-sink cap assembly | Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti +4 more | 1999-11-09 |
| 5977625 | Semiconductor package with low strain seal | David L. Edwards, Hilton T. Toy, Shaji Farooq, Patrick A. Coico | 1999-11-02 |
| 5891755 | Process for flat plate cooling a semiconductor chip using a thermal paste retainer | David L. Edwards, Sushumna Iruvanti, Gaetano P. Messina | 1999-04-06 |
| 5881945 | Multi-layer solder seal band for semiconductor substrates and process | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5881944 | Multi-layer solder seal band for semiconductor substrates | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5825087 | Integral mesh flat plate cooling module | Sushumna Iruvanti, Martin Klepeis, Gaetano P. Messina | 1998-10-20 |
| 5819402 | Method for cooling of chips using blind holes with customized depth | David L. Edwards, Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1998-10-13 |
| 5770478 | Integral mesh flat plate cooling method | Sushumna Iruvanti, Martin Klepeis, Gaetano P. Messina | 1998-06-23 |
| 5757620 | Apparatus for cooling of chips using blind holes with customized depth | David L. Edwards, Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1998-05-26 |
| 5724729 | Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials | Mark G. Courtney, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1998-03-10 |