ME

Michael Emmett

IBM: 3 patents #26,272 of 70,183Top 40%
Overall (All Time): #1,624,638 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6332946 Method for assembling a multi-layered ceramic package Ronald L. Hering, Eric B. Hultmark, Howard D. Hutchinson 2001-12-25
6294408 Method for controlling thermal interface gap distance David L. Edwards, Sushumna Iruvanti, Raed A. Sherif, Kamal K. Sikka, Hilton T. Toy 2001-09-25
6112795 Fixture for multi-layered ceramic package assembly Ronald L. Hering, Eric B. Hultmark, Howard D. Hutchinson 2000-09-05