| 6599774 |
Technique for underfilling stacked chips on a cavity MLC module |
Brian C. Noble |
2003-07-29 |
| 6332946 |
Method for assembling a multi-layered ceramic package |
Michael Emmett, Ronald L. Hering, Howard D. Hutchinson |
2001-12-25 |
| 6232667 |
Technique for underfilling stacked chips on a cavity MLC module |
Brian C. Noble |
2001-05-15 |
| 6112795 |
Fixture for multi-layered ceramic package assembly |
Michael Emmett, Ronald L. Hering, Howard D. Hutchinson |
2000-09-05 |
| 6049456 |
Electronic module adjustment design and process using shims |
Gaetano P. Messina, Armando S. Cammarano, Patrick A. Coico, Ronald L. Hering, Raed A. Sherif |
2000-04-11 |
| D304715 |
Heat sink or similar article |
Joseph L. Horvath |
1989-11-21 |
| 4771366 |
Ceramic card assembly having enhanced power distribution and cooling |
Bruce E. Blake, Frank P. Presti, Raymond Ricci, Roger A. Rippens |
1988-09-13 |
| 4546405 |
Heat sink for electronic package |
Claude Metreaud, Robert A. Yacavonis |
1985-10-08 |
| T105403 |
Method of manufacturing a sealing cap for an integrated circuit carrying substrate |
— |
1985-05-07 |
