Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6599774 | Technique for underfilling stacked chips on a cavity MLC module | Brian C. Noble | 2003-07-29 |
| 6332946 | Method for assembling a multi-layered ceramic package | Michael Emmett, Ronald L. Hering, Howard D. Hutchinson | 2001-12-25 |
| 6232667 | Technique for underfilling stacked chips on a cavity MLC module | Brian C. Noble | 2001-05-15 |
| 6112795 | Fixture for multi-layered ceramic package assembly | Michael Emmett, Ronald L. Hering, Howard D. Hutchinson | 2000-09-05 |
| 6049456 | Electronic module adjustment design and process using shims | Gaetano P. Messina, Armando S. Cammarano, Patrick A. Coico, Ronald L. Hering, Raed A. Sherif | 2000-04-11 |
| D304715 | Heat sink or similar article | Joseph L. Horvath | 1989-11-21 |
| 4771366 | Ceramic card assembly having enhanced power distribution and cooling | Bruce E. Blake, Frank P. Presti, Raymond Ricci, Roger A. Rippens | 1988-09-13 |
| 4546405 | Heat sink for electronic package | Claude Metreaud, Robert A. Yacavonis | 1985-10-08 |
| T105403 | Method of manufacturing a sealing cap for an integrated circuit carrying substrate | — | 1985-05-07 |