| 6049456 |
Electronic module adjustment design and process using shims |
Gaetano P. Messina, Patrick A. Coico, Ronald L. Hering, Eric B. Hultmark, Raed A. Sherif |
2000-04-11 |
| 5881944 |
Multi-layer solder seal band for semiconductor substrates |
David L. Edwards, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more |
1999-03-16 |
| 5881945 |
Multi-layer solder seal band for semiconductor substrates and process |
David L. Edwards, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more |
1999-03-16 |
| 5442239 |
Structure and method for corrosion and stress-resistant interconnecting metallurgy |
Giulio DiGiacomo, Nunzio DiPaolo |
1995-08-15 |
| 5266522 |
Structure and method for corrosion and stress-resistant interconnecting metallurgy |
Giulio DiGiacomo, Nunzio DiPaolo |
1993-11-30 |
| 5192622 |
Low-cost ternary composite for use in vias in glass-ceramic structures |
Giulio DiGiacomo, Nunzio DiPaolo |
1993-03-09 |
| 5175609 |
Structure and method for corrosion and stress-resistant interconnecting metallurgy |
Giulio DiGiacomo, Nunzio DiPaolo |
1992-12-29 |
| 4465223 |
Process for brazing |
Giulio DiGiacomo |
1984-08-14 |
| 4360289 |
Pin for brazing to a substrate and improved package resulting therefrom |
Giulio DiGiacomo |
1982-11-23 |
| 4272722 |
Determination of electric current flow patterns |
Giulio DiGiacomo, Stephen S. Drofitz, Jr. |
1981-06-09 |
