| 9402334 |
Method for controlling airflow of directional flow perforated tile |
David P. Graybill, Allan R. Hoeft, Madhusudan K. Iyengar, Roger R. Schmidt, Gerard V. Weber, Jr. |
2016-07-26 |
$5,666,000 |
| 9132519 |
Directly connected heat exchanger tube section and coolant-cooled structure |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +2 more |
2015-09-15 |
$3,796,000 |
| 8687364 |
Directly connected heat exchanger tube section and coolant-cooled structure |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +2 more |
2014-04-01 |
$5,095,000 |
| 7724527 |
Method and structure to improve thermal dissipation from semiconductor devices |
David L. Edwards, Richard F. Indyk, David C. Long |
2010-05-25 |
$4,007,000 |
| 7518235 |
Method and structure to provide balanced mechanical loading of devices in compressively loaded environments |
David L. Edwards, Benjamin V. Fasano, Lewis S. Goldmann, Ellyn M. Ingalls, Michael S. June +2 more |
2009-04-14 |
$4,368,000 |
| 7468886 |
Method and structure to improve thermal dissipation from semiconductor devices |
David L. Edwards, Richard F. Indyk, David C. Long |
2008-12-23 |
$10,467,000 |
| 6964885 |
Stress resistant land grid array (LGA) module and method of forming the same |
James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar M. Kamath +4 more |
2005-11-15 |
$8,461,000 |
| 6955543 |
Method and apparatus to form a reworkable seal on an electronic module |
Gaetano P. Messina, Lewis S. Goldmann, Richard F. Indyk, Vladimir Jambrih, Jeffrey A. Zitz |
2005-10-18 |
$9,308,000 |
| 6908025 |
Preparing MCM hat for removal |
Steven P. Ostrander, Sudipta K. Ray |
2005-06-21 |
$6,933,000 |
| 6703560 |
Stress resistant land grid array (LGA) module and method of forming the same |
James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar M. Kamath +4 more |
2004-03-09 |
$11,976,000 |
| 6354844 |
Land grid array alignment and engagement design |
Benjamin V. Fasano |
2002-03-12 |
$13,941,000 |
| 6339534 |
Compliant leads for area array surface mounted components |
Luc Guerin |
2002-01-15 |
$19,229,000 |
| 6333209 |
One step method for curing and joining BGA solder balls |
James H. Covell, Lewis S. Goldmann, Kimberly A. Kelly |
2001-12-25 |
|
| 6278184 |
Solder disc connection |
Peter J. Brofman, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more |
2001-08-21 |
$21,309,000 |
| 6278193 |
Optical sensing method to place flip chips |
James H. Covell |
2001-08-21 |
$21,309,000 |
| 6255139 |
Method for providing a thermal path through particles embedded in a thermal cap |
David L. Edwards, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif, Hilton T. Toy |
2001-07-03 |
$26,086,000 |
| 6253986 |
Solder disc connection |
Peter J. Brofman, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more |
2001-07-03 |
$26,086,000 |
| 6111314 |
Thermal cap with embedded particles |
David L. Edwards, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif, Hilton T. Toy |
2000-08-29 |
$31,033,000 |
| 6070321 |
Solder disc connection |
Peter J. Brofman, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more |
2000-06-06 |
$33,361,000 |
| 6049456 |
Electronic module adjustment design and process using shims |
Gaetano P. Messina, Armando S. Cammarano, Ronald L. Hering, Eric B. Hultmark, Raed A. Sherif |
2000-04-11 |
$38,584,000 |
| 5975409 |
Ceramic ball grid array using in-situ solder stretch |
Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more |
1999-11-02 |
$18,540,000 |
| 5977625 |
Semiconductor package with low strain seal |
David L. Edwards, Raed A. Sherif, Hilton T. Toy, Shaji Farooq |
1999-11-02 |
$18,540,000 |
| 5968670 |
Enhanced ceramic ball grid array using in-situ solder stretch with spring |
Peter J. Brofman, Mark G. Courtney, James H. Covell, Shaji Farooq, Lewis S. Goldmann +6 more |
1999-10-19 |
$17,852,000 |
| 5964396 |
Enhanced ceramic ball grid array using in-situ solder stretch with clip |
Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more |
1999-10-12 |
$40,366,000 |
| 5773561 |
Polymer sealants/adhesives and use thereof in electronic package assembly |
Krishna G. Sachdev, Michael Berger, Frank L. Pompeo |
1998-06-30 |
$9,812,000 |
