Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9402334 | Method for controlling airflow of directional flow perforated tile | David P. Graybill, Allan R. Hoeft, Madhusudan K. Iyengar, Roger R. Schmidt, Gerard V. Weber, Jr. | 2016-07-26 |
| 9132519 | Directly connected heat exchanger tube section and coolant-cooled structure | Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +2 more | 2015-09-15 |
| 8687364 | Directly connected heat exchanger tube section and coolant-cooled structure | Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +2 more | 2014-04-01 |
| 7724527 | Method and structure to improve thermal dissipation from semiconductor devices | David L. Edwards, Richard F. Indyk, David C. Long | 2010-05-25 |
| 7518235 | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments | David L. Edwards, Benjamin V. Fasano, Lewis S. Goldmann, Ellyn M. Ingalls, Michael S. June +2 more | 2009-04-14 |
| 7468886 | Method and structure to improve thermal dissipation from semiconductor devices | David L. Edwards, Richard F. Indyk, David C. Long | 2008-12-23 |
| 6964885 | Stress resistant land grid array (LGA) module and method of forming the same | James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar M. Kamath +4 more | 2005-11-15 |
| 6955543 | Method and apparatus to form a reworkable seal on an electronic module | Gaetano P. Messina, Lewis S. Goldmann, Richard F. Indyk, Vladimir Jambrih, Jeffrey A. Zitz | 2005-10-18 |
| 6908025 | Preparing MCM hat for removal | Steven P. Ostrander, Sudipta K. Ray | 2005-06-21 |
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same | James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar M. Kamath +4 more | 2004-03-09 |
| 6354844 | Land grid array alignment and engagement design | Benjamin V. Fasano | 2002-03-12 |
| 6339534 | Compliant leads for area array surface mounted components | Luc Guerin | 2002-01-15 |
| 6333209 | One step method for curing and joining BGA solder balls | James H. Covell, Lewis S. Goldmann, Kimberly A. Kelly | 2001-12-25 |
| 6278184 | Solder disc connection | Peter J. Brofman, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more | 2001-08-21 |
| 6278193 | Optical sensing method to place flip chips | James H. Covell | 2001-08-21 |
| 6255139 | Method for providing a thermal path through particles embedded in a thermal cap | David L. Edwards, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif, Hilton T. Toy | 2001-07-03 |
| 6253986 | Solder disc connection | Peter J. Brofman, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more | 2001-07-03 |
| 6111314 | Thermal cap with embedded particles | David L. Edwards, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif, Hilton T. Toy | 2000-08-29 |
| 6070321 | Solder disc connection | Peter J. Brofman, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more | 2000-06-06 |
| 6049456 | Electronic module adjustment design and process using shims | Gaetano P. Messina, Armando S. Cammarano, Ronald L. Hering, Eric B. Hultmark, Raed A. Sherif | 2000-04-11 |
| 5975409 | Ceramic ball grid array using in-situ solder stretch | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-11-02 |
| 5977625 | Semiconductor package with low strain seal | David L. Edwards, Raed A. Sherif, Hilton T. Toy, Shaji Farooq | 1999-11-02 |
| 5968670 | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Peter J. Brofman, Mark G. Courtney, James H. Covell, Shaji Farooq, Lewis S. Goldmann +6 more | 1999-10-19 |
| 5964396 | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-10-12 |
| 5773561 | Polymer sealants/adhesives and use thereof in electronic package assembly | Krishna G. Sachdev, Michael Berger, Frank L. Pompeo | 1998-06-30 |